tag: Mentor Graphics

Tuning Heterogeneous SoCs
By Brian Bailey - 08 Dec, 2016 - Comments: 0

It's one thing to pack multiple processor cores into a design, but it is much more difficult to ensure the hardware matches the software's requirements, or that the software optimally uses the hardware. Both the hardware and software teams are now facing these issues, and there are few tools to help them fully understand the problems or to provide solutions. Design teams continue to add more... » read more

Analog’s Rising Status
By Ann Mutschler - 08 Dec, 2016 - Comments: 1

As more sensors and actuators are added into electronic devices, pressure is growing to more seamlessly move data seamlessly back and forth between analog and digital circuitry. [getkc id="37" kc_name="Analog"] and digital always have fit rather uncomfortably together, and that discomfort has grown as [getkc id="81" kc_name="SoCs"] are built using smaller feature sizes. While digital transis... » read more

Reflecting Back on 2016: Markets
By Brian Bailey - 08 Dec, 2016 - Comments: 0

Anyone can make a prediction, and sometimes the more outlandish they are the more they get noticed. But at the end of the year some people hit the mark while others may have been way off. Many people simply make projections based on the current trajectory of trends, while others look for the potential discontinuities that may lie ahead. Semiconductor Engineering examines the projections made... » read more

Low-Power Design Is A Corporate Mindset At ARM
By Mentor, a Siemens Business - 07 Dec, 2016 - Comments: 0

The use of the PowerPro platform in the methodology outlined in this paper provides ARM with an RTL design flow which is power-centric. The ability to perform daily RTL power analysis at the block/unit level provides rapid turnaround on the power trend, while weekly analysis provides more complete benchmark reference metrics. To read more, click here. » read more

Timing Closure Issues Resurface
By Ed Sperling - 07 Dec, 2016 - Comments: 1

Timing closure has resurfaced as a major challenge at 10nm and 7nm due to more features and power modes, increased process variation and other manufacturing-related issues. While timing-related problems are roughly correlated to rising complexity in semiconductors, they tend to generate problems in waves—about once per decade. In SoCs, timing closure problems have spawned entire methodolog... » read more

Blog Review: Dec. 7
By Jesse Allen - 07 Dec, 2016 - Comments: 0

Mentor's Harry Foster looks at verification results findings in terms of schedules, number of required spins, and classification of functional bugs, in the latest installment of the Wilson Research Group verification study. Cadence's Paul McLellan provides an overview of the portable stimulus standard currently being worked on at Accellera. Synopsys' Anika Malhotra checks out JESD204B, a ... » read more

Car Becomes A Living Platform
By Ann Mutschler - 05 Dec, 2016 - Comments: 0

Future generations of vehicles will age like any other electronic or mechanical devices, but they also will need to adapt, grow, and change in unexpected ways over time to avoid being hacked, rendered obsolete, or otherwise compromised. This adds a whole new set of challenges never seen before in automotive development, and OEMs are working feverishly to bring system architectures up to ... » read more

The Week In Review: Design
By Jesse Allen - 02 Dec, 2016 - Comments: 0

Deals Kilopass extended its deal with ICScape, which makes a Parallel SPICE simulator, for eNVM IP at advanced finFET nodes. Kilopass has been working with ICScape for the past couple of years as part of its qualification methodology. IP Silvaco released three MIPI I3C sensor controller IP cores. Developed with NXP to push adoption of I3C, the new products are an Advanced Slave core wi... » read more

Can Startups Solve Today’s Automotive Challenges?
By Ann Mutschler - 01 Dec, 2016 - Comments: 0

When asked about the most pressing concerns today amongst automotive customers, some leading industry suppliers had the following to say: Samer Hijazi, senior design engineering architect, IP Group at Cadence: How fast can I deploy? Ron DiGiuseppe, Senior Strategic Marketing Manager at Synopsys: Our customers are very broadly requiring ISO26262 safety compliance in our products as well a... » read more

Optimizing Multiple IoT Layers
By Ann Mutschler - 01 Dec, 2016 - Comments: 0

As the number of connected devices rises, so do questions about how to optimize them for target markets, how to ensure they play nicely together, and how to bring them to market quickly and inexpensively. [getkc id="76" kc_name="IoT"] is broad term that encompasses a lot of disparate pieces for devices, systems, and connected systems. At the highest levels are hardware and software, but with... » read more

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