In Search of Life On The Exoplanets


Space exploration is a constant driver of scientists around the world, searching for life on planets outside our solar system (exoplanets). The news is often filled by wondrous discoveries and promising leads that point to potential life outside of Earth. This search often depends on a key piece of technology – the analog-to-digital converter (ADC) that accurately maps analog imaging to a dig... » read more

What’s Next In Neural Networking?


Faster chips, more affordable storage, and open libraries are giving neural network new momentum, and companies are now in the process of figuring out how to optimize it across a variety of markets. The roots of neural networking stretch back to the late 1940s with Claude Shannon’s Information Theory, but until several years ago this technology made relatively slow progress. The rush towar... » read more

The Week In Review: IoT


Finance SENSORO reports receiving $18 million in Series B funding from Robert Bosch Venture Capital, Sumitomo, and Tsing Capital. Nokia Growth Partners provided $10 million in first-round financing two years ago. SENSORO, which provides Internet of Things sensor devices and network technology, was established in 2013 as part of the Microsoft Accelerator program. Daylight Investors of Los An... » read more

Design Complexity Drives New Automation


As design complexity grows, so does the need for every piece in the design flow—hardware, software, IP, as well as the ecosystem — to be tied together more closely. At one level, design flow capacity is simply getting bigger to accommodate massive [getkc id="185" kc_name="finFET"]-class designs. But beyond sheer size, there are new interactions in the design flow that place much more emp... » read more

The Democratization Of CFD


“Democratization” is a buzzword that has been circulating around the Computational Fluid Dynamics (CFD) community for some time. In this White Paper, Keith Hanna and Ivo Weinhold of Mentor Graphicsdefine the issue, establish the facts, look at the pros and cons of various technology solutions being offered in the market today, and then suggest some pointers for the future as the CFD industr... » read more

Virtual PCIe Delivers A “Shift Left” In Software-Defined Networking Emulation


This paper reviews both SW and UVM Vector Based Verification (VBV) methodologies and Advanced Vector Based Verification (AVBV) that uses Software Defined Networking (SDN) HW to service PCIe transactions to the DUT. When deploying VBV methodologies, using the Veloce Transactor Library (VTL) family of components is most appropriate for UVM, C++ and SDK testbench methodologies. We explore how V... » read more

Blog Review: April 12


Cadence's Paul McLellan discusses the legal concerns around autonomous vehicles, emotion-based driver monitoring, and the role of LiDAR, from the CASPA Symposium on Autonomous Driving. The IEEE Design & Test's Magdy Abadir interviews Mentor's Wally Rhines in a discussion ranging from EDA growth and its economics to the increasing complexity of verification. Synopsys' Robert Vamosi exa... » read more

Supporting CPUs Plus FPGAs


While it has been possible to pair a CPU and FPGA for quite some time, two things have changed recently. First, the industry has reduced the latency of the connection between them and second, we now appear to have the killer app for this combination. Semiconductor Engineering sat down to discuss these changes and the state of the tool chain to support this combination, with Kent Orthner, system... » read more

Time For New Rules


Is Moore's Law dead? Brigadier General Paul Fredenburgh, commandant of the Dwight D. Eisenhower School for National Security and Resource Strategy, asked that question to four industry CEOs last week while visiting Silicon Valley with some of his students. He received four highly nuanced, if not different, answers. Left to right: Lip-Bu Tan, Cadence; Wally Rhines, Mentor Graphics; Simon Se... » read more

2.5D, FO-WLP Issues Come Into Focus


Advanced packaging is beginning to take off after years of hype, spurred by 2.5D implementations in high-performance markets and fan-out wafer-level packaging for a wide array of applications. There are now more players viewing packaging as another frontier driving innovation. But perhaps a more telling sign is that large foundries in Taiwan have begun offering packaging services to customer... » read more

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