tag: packaging

Eliminating Interfacial Delamination in High-Power Automotive Devices
By Chin Joo Tan - 20 Mar, 2025 - Comments: 0

Highly reliable power devices are always demanded by the automotive industry, especially with the surge in electric vehicle (EV) sales. These devices are expected to withstand harsh conditions and, at the same time, deliver consistent performances. Interfacial delamination is a significant factor that can impact the reliability performance of power devices. It refers to the separation of lay... » read more

Using Glass As A Dielectric In Electronic Packaging
By Dick Otte - 20 Mar, 2025 - Comments: 0

As demand for higher-performance, more compact and energy-efficient electronics continues to escalate, traditional organic based substrates are approaching practical limitations, leading to industry experimentation with alternative materials. To this end, glass substrates have emerged as a promising alternative with distinct benefits for semiconductor packaging. Major chipmakers, including ... » read more

AI And Semiconductor In Reciprocity
By Mike Hung - 20 Mar, 2025 - Comments: 0

In today’s rapidly advancing technological era, AI has become a powerful catalyst for innovation and progress. Advanced semiconductor packaging plays a crucial role in supporting AI development, while AI applications create new semiconductor demands and drive the development of semiconductor technologies, with both complementing each other. Semiconductor packaging: The bridge between chip an... » read more

Challenges Grow For Medical ICs
By Gregory Haley - 03 Mar, 2025 - Comments: 0

Demand for medical ICs used inside and outside the body is growing rapidly, but unique manufacturing and functional requirements coupled with low volumes have turned this into a complex and extremely challenging market. Few semiconductor applications demand this level of precision, reliability, and long-term stability. Unlike consumer electronics, where failure might mean a reboot or chip re... » read more

Energy Saving In Semiconductor Packaging Plating Processes Through Chemical Deflashing Process Optimization
By Arieff Yusoff - 20 Feb, 2025 - Comments: 0

In response to the rising focus on sustainable manufacturing practices and corporate social responsibility, there has been a surge of interest in adopting environmentally friendly and green chemicals for semiconductor manufacturing processes. These alternatives aim to minimize hazards while promoting greater sustainability. Notably, this trend extends to exploring substitutes for conventional c... » read more

An Innovative Hybrid Cleaning Approach For Contaminant Removal in Semiconductor Packaging
By Chun Yuan Lim - 23 Jan, 2025 - Comments: 0

The growing demand for power semiconductors, which control large currents and voltages, has resulted in their widespread use in various electronic devices, including electric vehicles (EVs). The requirement for greater performance and smaller devices has led to increased operating temperatures for these power semiconductors. This rise in temperature poses a challenge as it often leads to delami... » read more

Analysis Of Multi-Chiplet Package Designs And Requirements For Production Test Simplification
By Vineet Pancholi - 21 Nov, 2024 - Comments: 1

In recent years there has been a sharp rise of multi-die system designs. Numerous publications targeting a large variety of applications exist in the public domain. One presentation [2] on the IEEE’s website does a good job of detailing the anecdotal path of multi-die systems by way of chiplet building blocks integrated within a single package [2]. The presentation includes references to a ha... » read more

Revolutionizing IC Packaging With High-Density RDL Technology
By Curtis Zwenger - 24 Oct, 2024 - Comments: 0

The demand for high-performance devices, particularly in AI, HPC, and data centers, has surged dramatically in the ever-evolving landscape of integrated circuit technology. This demand has been further accelerated by the COVID-19 pandemic, pushing the boundaries of silicon technology to its limits. Enter Amkor’s S-SWIFT, a packaging solution designed to address these challenges and revolution... » read more

The Long Climb: Bringing Through Glass Vias (TGV) To High-Volume Manufacturing
By Keith Best - 15 Oct, 2024 - Comments: 0

The semiconductor industry is a land of peaks and valleys. It’s a place where each innovation represents the culmination of a long and often difficult climb to the summit. In the case of glass substrates, the peak of the mountain is in sight. The arrival of glass substrates comes at an opportune time, as the industry eyes new process innovations to meet the incredible demand for high perfo... » read more

Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications
By InRak Kim - 19 Sep, 2024 - Comments: 0

The conventional flip chip ball grid array (FCBGA) package platform has wide industry usage and provides high electrical performance. However, as high performance requirements increased, it encounters significant challenges. FCBGA packages frequently encounter underfill cracks after long term reliability or harsh reliability test conditions for automotive devices. Figure 1 shows the typical und... » read more

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