tag: packaging

Rise Of The Old Fab
By Ed Sperling - 17 Dec, 2015 - Comments: 0

Growth in the [getkc id="260" comment="Internet of Everything"], along with the beginning of a shift toward systems in package, are creating buzz in a rather unlikely place—established and well-worn process nodes where equipment is scarce, semi-functional, and difficult to maintain. In the past, moving to the next node was a sign of progress, leaving behind the trailing edge of designs to ... » read more

How To Choose A Processor
By Ann Mutschler - 10 Dec, 2015 - Comments: 0

Choosing a processor might seem straightforward at first glance, but like many engineering challenges it's harder than it looks. When is a CPU better than a GPU, MCU, DSP or other type of processor? And for what design—or part of a design? For decades, the CPU has been the default choice. “It is deliberately designed to be pretty efficient at all tasks, is straightforward to program, ... » read more

Reflections On 2015
By Brian Bailey - 10 Dec, 2015 - Comments: 0

It is easy to make predictions, but few people can make them with any degree of accuracy. Most of the time, those predictions are forgotten by the end of the year and there is no one to do a tally of who holds more credibility for next year. Not so with Semiconductor Engineering. We like to hold people's feet to the fire, but while the "Pants-On-Fire" meter may be applicable to politicians, we ... » read more

The Pain Of Change
By Ed Sperling - 24 Nov, 2015 - Comments: 0

If the still evolving shift left has taught the semiconductor industry anything, it's that nothing can be counted on to stay the same for very long. The basic proposition of doing more earlier in the design cycle to speed up time to market—and thereby shifting everything left in the linear flow—means that every silo that has been constructed over the past several decades needs to be rethoug... » read more

Why Packaging Matters
By Ed Sperling - 19 Nov, 2015 - Comments: 1

The semiconductor package is changing. What was until very recently considered an afterthought is now becoming a key part of the design process at all major chipmakers, and a critical factor in the extension of Moore's Law. This is a sharp reversal of what was almost universally an afterthought in planar silicon design and manufacturing. Rarely was the package an integral part of the archite... » read more

Packaging Wars Ahead
By Ed Sperling - 19 Nov, 2015 - Comments: 0

There has been much talk about semiconductor industry consolidation, but the shift into advanced packaging could have more far-reaching effects than all the mega-deals so far. Packaging is big business. Yole Développement has pinned the market at $30 billion, but that's only a thin slice of the pie that's in play. Companies that win the packaging deals also have a good shot of winning the m... » read more

Tech Talk: 14nm And Stacked Die
By Ed Sperling - 11 Nov, 2015 - Comments: 0

Aashish Malhotra, marketing director for the ASIC Business Unit at GlobalFoundries, talks about 14nm process technology, the IP ecosystem, and why that technology node will be used as a platform for 2.5D and 3D stacked die across a wide range of markets including the Internet of Everything. [youtube vid=ukTRuedB7ZU] » read more

Security In 2.5D
By Ed Sperling - 12 Oct, 2015 - Comments: 2

The long-anticipated move to 2.5D and fan-outs is raising some familiar questions about security. Will multiple chips combined in an advanced package be as secure as SoCs where everything is integrated on the same die? The answer isn't a simple yes or no. Put in perspective, all chips are vulnerable to [getkc id="253" kc_name="side channel attacks"], hacking of memory—a risk that increases... » read more

Tech Talk: Configurable Logic
By Ed Sperling - 08 Oct, 2015 - Comments: 0

Cliff Lloyd, business development director at NXP Semiconductors, talks about designing in one part for many functions to reduce power consumption and cost. [youtube vid=ut5kCm0kNwE] » read more

Executive Insight: Lip-Bu Tan
By Ed Sperling - 01 Oct, 2015 - Comments: 1

Lip-Bu Tan, president and CEO of Cadence, sat down with Semiconductor Engineering to talk about consolidation, Moore's Law, and where the opportunities are in the IoT and automotive markets. What follows are excerpts of that conversation. SE: What are the big concerns for the semiconductor industry in general, and EDA in particular? Tan: Top on my list is all the consolidation that's goin... » read more

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