tag: Synopsys

Overcoming The Challenges Of Verifying Multi-Die Systems
By Synopsys - 12 Mar, 2024 - Comments: 0

Despite clear advantages of multi-die systems, the decision to design a multi-die system rather than a traditional monolithic SoC is not easy. There are numerous new challenges that stand in the way of multi-die system realization. This white paper focuses on the verification challenges of multi-die systems, including: Addressing capacity and performance for system verification Valid... » read more

Increased Automotive Data Use Raises Privacy, Security Concerns
By John Koon - 07 Mar, 2024 - Comments: 0

The amount of data being collected, processed, and stored in vehicles is exploding, and so is the value of that data. That raises questions that are still not fully answered about how that data will be used, by whom, and how it will be secured. Automakers are competing based on the latest versions of advanced technologies such as ADAS, 5G, and V2X, but the ECUs, software-defined vehicles, an... » read more

Securing DRAM Against Evolving Rowhammer Threats
By Aharon Etengoff - 07 Mar, 2024 - Comments: 0

Advanced process nodes and higher silicon densities are heightening DRAM's susceptibility to Rowhammer attacks, as reduced cell spacing significantly decreases the hammer count needed for bit flips. Rowhammer exploits DRAM’s single-capacitor-per-bit design to trigger bit flips in adjacent cells through repeated memory row accesses. This vulnerability allows attackers to manipulate data, re... » read more

Maximizing Energy Efficiency For Automotive Chips
By William Ruby - 07 Mar, 2024 - Comments: 0

Silicon chips are central to today’s sophisticated advanced driver assistance systems, smart safety features, and immersive infotainment systems. Industry sources estimate that now there are over 1,000 integrated circuits (ICs), or chips, in an average ICE car, and twice as many in an average EV. Such a large amount of electronics translates into kilowatts of power being consumed – equiva... » read more

V2X Path To Deployment Still Murky
By Ann Mutschler - 07 Mar, 2024 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss Vehicle-To-Everything (V2X) technology and the path to deployment, with Shawn Carpenter, program director for 5G and space at Ansys; Lang Lin, principal product manager at Ansys; Daniel Dalpiaz, senior manager product marketing, Americas, green industrial power division at Infineon; David Fritz, vice president of virtual and hy... » read more

Chiplet IP Standards Are Just The Beginning
By Ann Mutschler - 06 Mar, 2024 - Comments: 2

Experts at the Table: Semiconductor Engineering sat down to talk about chiplet standards, interoperability, and the need for highly customized AI chiplets, with Frank Schirrmeister, vice president solutions and business development at Arteris; Mayank Bhatnagar, product marketing director in the Silicon Solutions Group at Cadence; Paul Karazuba, vice president of marketing at Expedera; Stephen S... » read more

Blog Review: Mar. 6
By Jesse Allen - 06 Mar, 2024 - Comments: 0

Synopsys' Gandharv Bhatara notes that successfully deploying high-NA EUV will rely on computational lithography to provide accurate modeling of aberrations, compact 3D mask modeling, and expand inverse lithography to full-chip processing. Cadence's John Park argues for using a systematic and automated system for co-design and co-analysis of multi-die packages to reduce the margin for human e... » read more

Ensure Zero Functional CDC Signoff Defects With VC SpyGlass Integrated Solution
By Synopsys - 06 Mar, 2024 - Comments: 0

This whitepaper will explain how designers can ensure zero defects seamlessly using Synopsys VC SpyGlass as a single cockpit for not just structural CDC analysis but also for complete functional analysis. We will also cover how designers can utilize a single dashboard for tracking the functional CDC signoff progress over the course of the project. Click here to read more. » read more

Optimizing EDA Cloud Hardware And Workloads
By Aharon Etengoff - 04 Mar, 2024 - Comments: 0

Optimizing EDA hardware for the cloud can shorten the time required for large and complex simulations, but not all workloads will benefit equally, and much more can be done to improve those that can. Tens of thousands of GPUs and specialized accelerators, all working in parallel, add significant and elastic compute horsepower for complex designs. That allows design teams to explore various a... » read more

Chip Industry Week In Review
By The SE Staff - 01 Mar, 2024 - Comments: 0

By Adam Kovac, Karen Heyman, and Liz Allan. India approved the construction of two fabs and a packaging house, for a total investment of about $15.2 billion, according to multiple sources. One fab will be jointly owned by Tata and Taiwan's Powerchip. The second fab will be a joint investment between CG Power, Japan's Renesas Electronics, and Thailand's Stars Microelectronics. Tata will run t... » read more

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