Power-Aware Test Vector Porting For Production ATE


Power management in contemporary system-on-chip (SoC) designs is almost unimaginably complex. Processors and other chip cores turn on and off as needed. Advanced features such as dynamic voltage and frequency scaling (DVFS) can adjust to changing conditions and incrementally adjust power and performance on the fly. Power management starts from the lowest hardware level of transistor structures ... » read more

AI’s Ability To Deliver Breakthroughs Across Semiconductor Design And Manufacturing


AI holds great promise for our industry. It will help close the divide between design, manufacturing and test that is required to effectively produce today’s most advanced hybrid devices. One way to look at the potential impact of AI in the semiconductor industry is to realize that it is more and more driven by software engineering. When designing a chip, it’s essentially like writing... » read more

Silicon Carbide And Gallium Nitride Bring New Challenges For Semiconductor Test


In the era of megatrends such as electric vehicles (EVs), new technologies are emerging to keep up with evolving demands. One example of this is the evolution of compound semiconductors that use silicon carbide (SiC) and gallium nitride (GaN) for high-performance power systems. Innovating test protocols to handle wide bandgap materials For many power-related applications, the semiconductor in... » read more

A Renaissance Of Innovation


Innovation in semiconductor testing plays a critical role in the advancement of the semiconductor industry, ensuring that the chips and components that power modern technology are reliable, efficient, and capable of meeting the ever-increasing demands of various applications. As semiconductors become more complex, the methods and technologies used to test them must also evolve to maintain quali... » read more

Complex Heterogeneous Integration Drives Innovation In Semiconductor Test


Heterogeneous integration is driving innovation in the semiconductor industry, but it also introduces more complexity in chip design, which translates to more intricate test requirements. The automated test equipment (ATE) industry is responding, developing and utilizing more sophisticated test equipment capable of handling the diverse functionalities and interfaces needed to test heterogeneous... » read more

New Challenges In IC Reliability


Experts at the Table: Semiconductor Engineering sat down to discuss reliability of chips, how it is changing, and where the new challenges are, with Steve Pateras, vice president of marketing and business development at Synopsys; Noam Brousard, vice president of solutions engineering at proteanTecs; Harry Foster, chief verification scientist at Siemens EDA; and Jerome Toublanc, high-tech soluti... » read more

ML Model Usage For Various Life Stages Of Semiconductor Test


By Shinji Hioki and Ken Butler From development through high volume manufacturing (HVM), semiconductor manufacturers’ pain points change based on the life stages. Each stage requires different types of applications to help with business needs. At the early stage, where the design and process are still immature, understanding the root causes of maverick material and implementing fixes is th... » read more

Signals In The Noise: Tackling High-Frequency IC Test


The need for high-frequency semiconductor devices is surging, fueled by growing demand for advanced telecommunications, faster sensors, and increasingly autonomous vehicles. The advent of millimeter-wave communication in 5G and 6G is pushing manufacturers to develop chips capable of handling frequencies that were once considered out of reach. However, while these technologies promise faster ... » read more

How The Semiconductor Ecosystem Is Responding To Its Global Challenges


The semiconductor industry is changing rapidly, with government support for re-shoring capacity creating new interplay among resources in Asia, the U.S., and Europe—even as the industry develops and sustains new technologies like HBM and heterogeneous integration. Geopolitical factors such as the CHIPS (Creating Helpful Incentives to Produce Semiconductors for America) Act, the scarcity of s... » read more

Standardizing Defect Coverage In Analog/Mixed Signal Test


A newly drafted IEEE standard will bring more consistency to defect metrics in analog/mixed (AMS) designs, a long-overdue step that has become too difficult to ignore in the costly heterogeneous assemblies being deployed inside of data centers and mobile devices. Standardizing analog is no simple feat due to the legacy approach to AMS design, and this is not the first attempt at improving te... » read more

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