tag: test

Reducing Chip Test Costs With AI-Based Pattern Optimization
By Rahul Singhal - 31 Jul, 2023 - Comments: 0

The old adage “time is money” is highly applicable to the production testing of semiconductor devices. Every second that a wafer or chip is under test means that the next part cannot yet be tested. The slower the test throughput, the more automatic test equipment (ATE) is needed to meet production throughput demands. This is a huge issue for chip producers, since high pin counts, blazingly ... » read more

How Software Can Help Redefine Semiconductor Validation
By Jake Azbell - 11 Jul, 2023 - Comments: 0

The rate of technological advancement is increasing faster than ever before. Although the demands for meeting aggressive time-to-market requirements and innovating at warp speed are not new, they are continuing to accelerate. To cut costs without compromising product quality, engineers are now expected to test new designs more rapidly at various stages of development. Even though many organizat... » read more

How ADAS and EVs Drive Semiconductor-To-Automotive Supply Chain Innovation
By Joey Tun - 27 Jun, 2023 - Comments: 0

As EV and ADAS become the focus for the automotive industry, the supply chain is going through a transformation. The industry is keenly reminded of recent semiconductor shortages as well as the growing semiconductor content requirements per vehicle.  This prompts the entire supply chain including traditional semiconductor suppliers, Tier-1s, and automotive OEMs to rethink their strategies not ... » read more

Verification And Test Of Safety And Security
By Brian Bailey - 22 Jun, 2023 - Comments: 0

Functional verification can cost as much as design, but new capabilities are piling onto an already stressed verification methodology, leaving solutions fragmented and incomplete. In a perfect world, a semiconductor device would be verified to operate according to its complete specification, and continue to operate correctly over the course of its useful life. The reality, however, is this i... » read more

EDA’s Role Grows For Preventing And Identifying Failures
By Karen Heyman - 08 Jun, 2023 - Comments: 0

The front end of design is becoming more tightly integrated with the back end of manufacturing, driven by the rising cost and impact of failures in advanced chips and critical applications. Ironically, the starting point for this shift is failure analysis (FA), which typically happens when a device fails to yield, or worse, when it is returned due to some problem. In production, that leads t... » read more

From Lab To Fab: Increasing Pressure To Fuse IC Processes
By Gregory Haley - 06 Jun, 2023 - Comments: 0

Test, metrology, and inspection are essential for both the lab and the fab, but fusing them together so that data created in one is easily transferred to the other is a massive challenge. The chip industry has been striving to bridge these separate worlds for years, but the economics, speed, and complexity of change require a new approach. The never-ending push toward smaller, better-defined... » read more

Ramping Up Power Electronics For EVs
By Anne Meixner - 06 Jun, 2023 - Comments: 0

The rapid acceleration of the power devices used in electric vehicles (EVs) is challenging chipmakers to adequately screen the ICs that power these vehicles.[1] While progress toward autonomous driving is grabbing the public’s attention, the electrification of transportation systems is progressing quietly. For the automotive industry, this shift involves a mix of electronic components. Amo... » read more

Power-Supply Card Targets High-Voltage PMIC Test
By Toni Dircherl - 06 Jun, 2023 - Comments: 0

The electronics industry is seeing a move toward higher voltages and currents to deliver sufficient supply and charging power in products ranging from handheld cellphones and tablets to workstations. This trend is evidenced in examples such as the many USB power-delivery (PD) profiles with ratings ranging from 10W (5V at 2A for USB PD 3.0 profile 1) up to 100W (5V at 2A, 12V at 5A, and 20V at 5... » read more

Testing High Power Discrete Devices
By Tom Tran - 06 Jun, 2023 - Comments: 0

Emerging markets are driving the evolution of discrete power devices. Increased power requirements mean more power is being driven through a smaller device, creating challenges in both device design and test. This video series, 3 for 3, provides 3 answers for 3 pressing questions about trends in semiconductor test, and how testing for high power discrete devices is evolving. » read more

From Known Good Die To Known Good System With UCIe IP
By Manuel Mota - 11 May, 2023 - Comments: 0

Multi-die systems are made up of several specialized functional dies (or chiplets) that are assembled in the same package to create the complete system. Multi-die systems have recently emerged as a solution to overcome the slowing down of Moore’s law by providing a path to scaling functionality in the packaged chip in a way that is manufacturable with good yield. Additionally, multi-die sy... » read more

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