Enabling Seamless Monitoring, Test, And Repair In Multi-Die Designs

By Yervant Zorian - 10 Mar, 2026 - Comments: 0

By Yervant Zorian and Sandeep Kumar Goel Anyone who follows the semiconductor industry knows that the accelerating performance, scale and energy efficiency demands of the AI revolution are outpacing the advances achievable by simply pushing the chip performance of monolithic, single-die designs. Multi-die design using 2.5D and 3D technologies has emerged as a necessity to keep the pace of in... » read more

Monitor, Test, And Repair For Multi-Die Health And Reliability

By Yervant Zorian - 09 Sep, 2025 - Comments: 0

Ever since the earliest semiconductor devices, silicon health has been a concern. Systems manufacturers wanted to be sure that their chips worked properly before being soldered onto printed circuit boards (PCBs). They put pressure on semiconductor suppliers to test wafers, individual dies, and assembled parts before they were shipped. A wide range of design-for-test (DFT) approaches were develo... » read more

Ensuring The Health And Reliability Of Multi-Die Systems

By Yervant Zorian - 26 Oct, 2023 - Comments: 0

From generative AI tools that rapidly produce chatbot responses to high-performance computing (HPC) applications enabling financial forecasting and weather modeling, it’s clear we’re in a whole new realm of processing power demand. Given these compute-intensive workloads, monolithic SoCs are no longer capable to meet today’s processing needs. Engineering ingenuity, however, has answered t... » read more