tag: abstractions

Hardware From Specifications Using AI
By Brian Bailey - 06 May, 2026 - Comments: 0

There is a lot of excitement these days surrounding the idea that AI could make it possible to go from a specification to a design with absolutely no hardware skills. Well, get in line, because this is the umpteenth potential technology that was going to make that possible. Don't get me wrong, it just might do it, but will this be an implementation that is reliable, have decent performance, ... » read more

The Race Begins For Much Bigger Abstractions In Data Centers
By Ed Sperling - 17 Feb, 2026 - Comments: 0

Key Takeaways Data center build-out is enabling much larger and more complex abstractions. Competition is building for digital/virtual twins across multiple industry segments, including automotive, aerospace, and chip manufacturing. AI, and particularly AI agents, will play a significant role in sorting through data to find potential trouble spots. The frenzy of new data cen... » read more

Engineering After Orthogonalization: Why Verification Has Become A Lifecycle Discipline
By Harry Foster - 15 Jan, 2026 - Comments: 0

Over the past several decades studying verification practices across the semiconductor industry, I’ve watched assumptions that once held up remarkably well begin to strain under the weight of modern system complexity. This is not a loss of engineering rigor. It is the result of systems that no longer conform to the boundaries earlier design models depended on. For much of the industry’s ... » read more

Shaping The Future Of AI Processors: A Tech Threads Conversation With Jim Keller
By Nandan Nayampally - 25 Nov, 2025 - Comments: 0

I had the pleasure of hosting renowned computer architect and Tenstorrent CEO Jim Keller, on the latest episode of Baya Systems’ Tech Threads podcast. If you haven’t already, listen to get his insights on the need for “open” intelligence architectures and what would be needed to drive the semiconductor industry forward. What is an “open” intelligent architecture and ecosystem? As... » read more

Virtual Twins: Layers Of Challenges
By Ed Sperling - 15 Sep, 2025 - Comments: 0

Virtual twins can provide deep insights into complex systems at any point in time, but creating them requires integrating a stack of abstractions that don't naturally go together. One abstraction may be mechanical, another electrical, and the data used to create those abstraction layers needs to be fused together logically and updated over time. David Fried, corporate vice president at Lam Rese... » read more

Mixed Messages Complicate Mixed-Signal
By Brian Bailey - 26 Jun, 2025 - Comments: 0

Several years ago, analog and mixed signal (AMS) content hit a wall. Its contribution to first-time chip failure doubled, and there is no evidence that anything has improved dramatically since then. Some see that the problem is likely to get worse due to issues associated with advanced nodes, while others see hope for improvement coming from AI or chiplets. Fig. 1: Cause of ASIC respins. S... » read more

The Limits Of AI-Generated Models
By Brian Bailey - 26 Oct, 2023 - Comments: 2

In several recent stories, the subject of models has come up, and one recurrent theme is that AI may be able to help us generate models of a required abstraction. While this may be true in some cases, it is very dangerous in others. If we generalize, AI should be good for any model where the results are predominantly continuous, but discontinuities create problems. Unless those are found and... » read more

The Federation Needs A Taxonomy
By Brian Bailey - 28 Sep, 2023 - Comments: 0

While putting together the story about federated simulation, it brought back memories of an earlier part of my career when I spent a lot of time looking at modeling abstractions and simulation frameworks. In the mid-1990s, the notions of re-using pre-designed blocks of IP started to become popular, but the fledgling industry was in disarray. Every IP block had a different set of deliverables... » read more

A Power-First Approach
By Brian Bailey - 27 Oct, 2022 - Comments: 7

It is becoming evidently clear that heat will be the limiter for the future of semiconductors. Already, large percentages of a chip are dark at any time, because if everything operated at the same time the amount of heat generated would exceed the ability of the chip and package to dissipate that energy. If we now start to contemplate stacking dies, where the ability to extract heat remains con... » read more

The Next Incarnation Of EDA
By Brian Bailey - 25 Aug, 2022 - Comments: 0

The EDA industry has incrementally addressed issues as they arise in the design of electronic systems, but is there about to be a disruption? Academia is certainly seeing that as a possibility, but not all of them see it happening for the same reason. The academic community questioned the future of EDA at the recent Design Automation Conference. Rather than EDA as we know it going away, they... » read more

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