tag: Accenture

Chip Industry Week In Review
By The SE Staff - 12 Jul, 2024 - Comments: 0

The U.S. Department of Commerce issued a notice of intent  to fund new R&D activities to establish and accelerate domestic advanced packaging capacity. CHIPS for America expects to award up to $1.6 billion in funding innovation across five R&D areas, as outlined in the vision for the National Advanced Packaging Manufacturing Program (NAPMP), with about $150 million per award in each... » read more

Rapid Changes Add New Concerns For IC Industry
By Ed Sperling - 28 Feb, 2024 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss the impact of leading edge technologies such as generative AI in data centers, AR/VR, and security architectures for connected devices, with Michael Kurniawan, business strategy manager at Accenture; Kaushal Vora, senior director and head of business acceleration and ecosystem at Renesas Electronics; Paul Karazuba, vice preside... » read more

Broad Impact From Accelerating Tech Cycles
By Ed Sperling - 21 Feb, 2024 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss the impact of leading edge technologies such as generative AI in data centers, AR/VR, and security architectures for connected devices, with Michael Kurniawan, business strategy manager at Accenture; Kaushal Vora, senior director and head of business acceleration and ecosystem at Renesas Electronics; Paul Karazuba, vice preside... » read more

Preparing For An AI-Driven Future In Chips
By Ed Sperling - 01 Feb, 2024 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss the impact of AI on semiconductor architectures, tools, and security, with Michael Kurniawan, business strategy manager at Accenture; Kaushal Vora, senior director and head of business acceleration and ecosystem at Renesas Electronics; Paul Karazuba, vice president of marketing at Expedera; and Chowdary Yanamadala, technology s... » read more

Week In Review: Semiconductor Manufacturing, Test
By Karen Heyman - 06 Jan, 2023 - Comments: 0

TSMC is in advanced talks with key suppliers about setting up its first potential European plant in Dresden, Germany, according to Nikkei Asia. The company held a 3nm volume production and capacity expansion ceremony at its Fab 18. TSMC also is building 3nm capacity at its Arizona site, as well as opening a global R&D Center in the Hsinchu Science Park in the second quarter of 2023, to be ... » read more

Bespoke Silicon Rattles Chip Design Ecosystem
By Ann Mutschler - 19 Oct, 2022 - Comments: 0

Bespoke silicon developers are shaking up relationships, priorities, and methodologies across the semiconductor industry, creating demand for skills that cross traditional boundaries, and driving new business models that leverage these enormous investments. Bespoke silicon designers today are a rare breed, capable of understanding the unique requirements of a specific domain, as well as a gr... » read more

AEK: Powerpoint Is Easy—Change is Hard
By Paul McLellan - 04 Aug, 2022 - Comments: 0

A major message to big-name automakers at the Automobil Elektronik Kongress 2022 was, "You old-time car guys don't get it. We have to deliver a smartphone experience in a vehicle. If not, we will be out of our jobs, and someone else will." CARIAD I thought that the most interesting presentation was by Riclef Schmidt-Clausen of CARIAD. CARIAD is a spinout from Volkswagen (VW) of their software... » read more

Insights From Industry Strategy Symposium Europe 2022
By Cassandra Melvin - 21 Jul, 2022 - Comments: 0

The timely return to an in-person Industry Strategy Symposium (ISS) Europe was welcomed by participants from around the globe on May 30th at the Brussels Sheraton. ISS Europe 2022 featured a new program and event format – with industry insights and strategic topics condensed into one day of programming on three critical challenges facing the microelectronics industry: the energy crisis and su... » read more

Week In Review: Design, Low Power
By Jesse Allen - 08 Jul, 2022 - Comments: 0

Tools, IP, design Infineon Technologies acquired NoBug, a provider of design verification services. The acquisition will help Infineon expand its IoT R&D business in eastern Europe. “This considerable increase in superior verification know-how lets Infineon offer its customers more of its leading products at a reduced time-to-market,” said Guenter Krasser, Vice President and Managing D... » read more

Week In Review: Design, Low Power
By Jesse Allen - 01 Jul, 2022 - Comments: 0

IP, design Arm unveiled a number of new CPUs and GPUs. Based on the Armv9 architecture, the Cortex-X3 aims to improve single-threaded performance and targets a range of benchmarks and applications. The Cortex-A715 focuses on efficient performance, delivering a 20% energy efficiency gain and 5% performance uplift compared to Cortex-A710. In addition, the Cortex-A510 and DSU-110 were updated to ... » read more

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