Regulations Trail Autonomous Vehicles

By Kevin Fogarty - 09 Jul, 2018 - Comments: 0

Fragmented regulations and unrealistic expectations may be the biggest hurdles for chipmakers selling into the market for self-driving cars during the next few years. Carmakers and the semiconductor industry have made tremendous progress building real-time vision systems and artificial intelligence into relatively traditional automobiles during the past decade or so. But federal and state re... » read more

Hardware Acceleration With eFPGAs

By Alok Sanghavi - 07 Jun, 2018 - Comments: 0

If integrating an embedded FPGA (eFPGA) into your ASIC or SoC design strikes you as odd, it shouldn’t. ICs have been absorbing almost every component on a circuit board for decades, starting with transistors, resistors, and capacitors –– then progressing to gates, ALUs, microprocessors, and memories. FPGAs are simply one more useful component in the tool box, available for decades and ... » read more

FPGAs Becoming More SoC-Like

By Ann Mutschler - 04 Jun, 2018 - Comments: 1

FPGAs are blinged-out rockstars compared to their former selves. No longer just a collection of look-up tables (LUTs) and registers, FPGAs have moved well beyond into now being architectures for system exploration and vehicles for proving a design architecture for future ASICs. This family of devices now includes everything from basic programmable logic all the way up to complex SoC devices.... » read more

New Deep Learning Processors, Embedded FPGA Technologies, SoC Design Solutions

By Ty Garibay - 14 May, 2018 - Comments: 0

Some of the most valuable events at DAC are the IP Track sessions, which give small and midsize companies a chance to share innovations that might not get much attention elsewhere. The use of IP in SoCs has exploded in recent years. In a panel at DAC 2017, an industry expert noted that the IP market clearly was growing even faster than EDA itself, due to the fact that more and more chip mak... » read more

Challenges At The Edge

By Kevin Fogarty - 03 May, 2018 - Comments: 0

By Kevin Fogarty and Ed Sperling Edge computing is inching toward the mainstream as the tech industry begins grappling with the fact that far too much data will be generated by sensors to send everything back to the cloud for processing. The initial idea behind the IoT/IIoT, as well as other connected devices, was that simple sensors would relay raw data to the cloud for processing throug... » read more

The Week In Review: Design

By Jesse Allen - 27 Apr, 2018 - Comments: 0

M&A Alibaba acquired C-Sky Microsystems, which focuses on 32-bit embedded CPU IP cores in both low power and high performance varieties, as well as SoC and MCU platforms. Founded in 2001, the Hangzhou, China-based C-Sky previously received investment from Alibaba, and the two companies collaborated on a hardware and software platform for IoT and cloud integration. The deal comes on the hee... » read more

New Market Drivers

By Brian Bailey - 25 Apr, 2018 - Comments: 0

Semiconductor Engineering sat down to discuss changing market dynamics with Steve Mensor, vice president of marketing for [getentity id="22926" e_name="Achronix"]; Apurva Kalia, vice president of R&D in the System and Verification group of [getentity id="22032" e_name="Cadence"]; Mohammed Kassem, CTO for [getentity id="22910" comment="efabless"]; Matthew Ballance, product engineer and techn... » read more

Designing 5G Chips

By Ann Mutschler - 18 Apr, 2018 - Comments: 0

5G is the wireless technology of the future, and it’s coming fast. The technology boasts very high-speed data transfer rates, much lower latency than 4G LTE, and the ability to handle significantly higher densities of devices per cell site. In short, it is the best technology for the massive amount of data that will be generated by sensors in cars, IoT devices, and a growing list of next-g... » read more

The Week In Review: Design

By Jesse Allen - 13 Apr, 2018 - Comments: 0

Tools & IP Cadence unveiled its latest DSP for embedded vision and AI, Tensilica Vision Q6 DSP. The DSP is built on a 13-stage processor pipeline and new system architecture designed for use with large local memories, and achieves 1.5GHz peak frequency and 1GHz typical frequency at 16nm. Compared to its predecessor, it offers 1.5X greater vision and AI performance than its predecessor and ... » read more

High-Performance Memory Challenges

By Ann Mutschler - 12 Apr, 2018 - Comments: 1

Designing memories for high-performance applications is becoming far more complex at 7/5nm. There are more factors to consider, more bottlenecks to contend with, and more tradeoffs required to solve them. One of the biggest challenges is the sheer volume of data that needs to be processed for AI, machine learning or deep learning, or even in classic data center server racks. “The design... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Achronix

Regulations Trail Autonomous Vehicles

Hardware Acceleration With eFPGAs

FPGAs Becoming More SoC-Like

New Deep Learning Processors, Embedded FPGA Technologies, SoC Design Solutions

Challenges At The Edge

The Week In Review: Design

New Market Drivers

Designing 5G Chips

The Week In Review: Design

High-Performance Memory Challenges