tag: ADC

Catching Critical Defects In TSVs And Stacked Chips
By Laura Peters - 10 Feb, 2026 - Comments: 0

Key Takeaways Variation is becoming a bigger problem in multi-die assemblies with TSVs and hybrid bonding. Multi-modal approaches are required to test these devices. AI plays a role in improving defect capture rate and distinguishing between yield-killing and false positives. New methods for interconnecting devices using through-silicon vias (TSVs) and hybrid bonding in stac... » read more

Research Bits: Jan. 6
By Jesse Allen - 06 Jan, 2026 - Comments: 0

Ultrathin ferroelectric capacitors Researchers from the Institute of Science Tokyo and Canon ANELVA Corporation built an ultrathin ferroelectric memory capacitor stack using scandium-substituted aluminum nitride ((Al,Sc)N) thin films with platinum electrodes. The total thickness is just 30nm: a 20nm ferroelectric layer sandwiched between 5nm platinum top and bottom electrodes. “Previous r... » read more

Research Bits: Nov. 7
By Jesse Allen - 07 Nov, 2022 - Comments: 0

ADC side-channel attacks Researchers at MIT propose two ways to protect analog-to-digital converters (ADCs) from power and electromagnetic side-channel attacks. The researchers first investigated the side-channel attacks that could be used against ADCs. Power attacks usually involve an attacker soldering a resistor onto the device’s circuit board to measure its power usage. An electromagn... » read more

A Multi-Level Analog IC Design Flow For Fast Performance Estimation Using Template-Based Layout Generators And Structural Models
By Fraunhofer IIS/EAS - 12 Sep, 2022 - Comments: 0

Analog IC design is a very challenging task as essential information is missing in the early design stages. Because the simulation of larger designs is exceedingly computationally expensive at lower abstraction levels, conservative assumptions are usually applied that often result in suboptimal performances such as area and power consumption. In order to enable both early performance estimates ... » read more

The Human Hand: Curating Good Data And Creating An Effective Deep-Learning R2R Strategy For High-Volume Manufacturing
By Onto Innovation - 09 Aug, 2022 - Comments: 0

Currently, the semiconductor manufacturing industry uses artificial intelligence and machine learning to take data and autonomously learn from that data. With the additional data, AI and ML can be used to quickly discover patterns and determine correlations in various applications, most notably those applications involving metrology and inspection, whether in the front-end of the manufacturing ... » read more

Improving Yield With Machine Learning
By Laura Peters - 12 Jul, 2022 - Comments: 0

Machine learning is becoming increasingly valuable in semiconductor manufacturing, where it is being used to improve yield and throughput. This is especially important in process control, where data sets are noisy. Neural networks can identify patterns that exceed human capability, or perform classification faster. Consequently, they are being deployed across a variety of manufacturing proce... » read more

HBM, Nanosheet FETs Drive X-ray Fab Use
By Laura Peters - 08 Mar, 2022 - Comments: 0

Paul Ryan, vice president and general manager of Bruker’s X-ray Business, sat down with Semiconductor Engineering to discuss the movement of x-ray metrology into manufacturing to better control nanosheet film stacks and solder bump quality. SE: Where are you seeing the greatest growth right now, and what are the critical drivers for your technology from the application side? Ryan: One b... » read more

Power/Performance Bits: Dec. 14
By Jesse Allen - 14 Dec, 2021 - Comments: 0

Improved digital sensing Researchers from Imperial College London and Technical University of Munich propose a technique to improve the capability of many different types of sensors. The method addresses voltage limits in analog-to-digital converters and the saturation that results in poor quality when an incoming signal exceeds those limits. “Our new technique lets us capture a fuller ra... » read more

Power/Performance Bits: Aug. 3
By Jesse Allen - 03 Aug, 2021 - Comments: 0

Efficient ADC Researchers at Brigham Young University, National Yang Ming Chiao Tung University, Texas Instruments, and University of California Los Angeles designed a new power-efficient high-speed analog-to-digital converter. The ADC consumes only 21 milli-Watts of power at 10GHz for ultra-wideband wireless communications, much lower than other ADCs that consume hundreds of milli-Watts to... » read more

Re-Architecting SerDes
By Brian Bailey - 10 Dec, 2020 - Comments: 0

Serializer/Deserializer (SerDes) circuits have been helping semiconductors move data around for years, but new process technologies are forcing it to adapt and change in unexpected ways. Traditionally implemented as an analog circuit, SerDes technology has been difficult to scale, while low voltages, variation, and noise are making it more difficult to yield sufficiently. So to remain releva... » read more

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