tag: advanced packaging

ILP-Based Router for Wire-Bonding FBGA Packaging Design
By Technical Paper Link - 13 Feb, 2023 - Comments: 0

A new technical paper titled "ILP-Based Substrate Routing with Mismatched Via Dimension Consideration for Wire-bonding FBGA Package Design" was written by researchers at National Taiwan University of Science and Technology. "In this paper, we propose an integer linear programming (ILP)-based router for wire-bonding FBGA packaging design. Our ILP formulation not only can handle design-depende... » read more

Modeling and Thermal Analysis of 3DIC
By Technical Paper Link - 13 Feb, 2023 - Comments: 0

A new technical paper titled "Heat transfer in a multi-layered semiconductor device with spatially-varying thermal contact resistance between layers" was published by researchers at UT Arlington. "This work presents a theoretical model to determine the steady state temperature distribution in a general M-layer structure with spatial variation in thermal contact resistance between adjacent la... » read more

Big Changes Ahead For Chip Technology And Industry Dynamics
By Ed Sperling - 08 Feb, 2023 - Comments: 0

Semiconductor Engineering sat down to discuss the impact of customization and advanced packaging, and concerns about reliability and geopolitical rivalries with Martin van den Brink, president and CTO of ASML; Luc Van den Hove, CEO of imec; David Fried, vice president of computational products at Lam Research; and Ankur Gupta, vice president and general manager of the test group and lifecycle s... » read more

What Does 2023 Have In Store For Chip Design?
By Brian Bailey - 26 Jan, 2023 - Comments: 0

Predictions seem to be easier to make during times of stability, but they are no more correct than at any other period. During more turbulent times, fewer people are courageous enough to allow their opinions to be heard. And yet it is often those views that are more well thought through, and even if they turn out not to be true, they often contain some very enlightening ideas. 2022 saw some ... » read more

Collaboration Widens Among Big Chip Companies
By Ed Sperling - 23 Jan, 2023 - Comments: 1

Experts at the Table: Semiconductor Engineering sat down to discuss the growing need for collaboration among equipment and tools vendors, the impact of systems companies and increases in complexity, and how to handle a push for more customization while controlling costs, with Martin van den Brink, president and CTO of ASML; Luc Van den Hove, CEO of imec; David Fried, vice president of computati... » read more

An OSAT Perspective On Semiconductor Market Trends
By Vik Chaudhry - 19 Jan, 2023 - Comments: 0

For the semiconductor industry, 2022 was a very interesting year. On one hand, it witnessed shortages in the supply chain. On the other hand, the macro-economic situation turned and demand for several consumer and computing devices plummeted. A trade war with China and ensuing localization of supply chain with passage of CHIPS act took shape in 2022. The auto industry is still recovering from t... » read more

Unknowns And Challenges In Advanced Packaging
By Ed Sperling - 19 Jan, 2023 - Comments: 0

Dick Otte, CEO of Promex Industries, sat down with Semiconductor Engineering to talk about unknowns in material properties, the impact on bonding, and why environmental factors are so important in complex heterogeneous packages. What follows are excerpts of that conversation. SE: Companies have been designing heterogeneous chips to take advantage of specific applications or use cases, but th... » read more

Design And Verification Methodologies Breaking Down
By Brian Bailey - 12 Jan, 2023 - Comments: 0

Tools, methodologies and flows that have been in place since the dawn of semiconductor design are breaking down, but this time there isn't a large pool of researchers coming up with potential solutions. The industry is on its own to formulate those ideas, and that will take a lot of cooperation between EDA companies, fabs, and designers, which has not been their strong point in the past. It ... » read more

Looking Inside Of Chips
By Ed Sperling - 10 Jan, 2023 - Comments: 0

Shai Cohen, co-founder and CEO of proteanTecs, sat down with Semiconductor Engineering to talk about how to boost reliability and add resiliency into chips and advanced packaging. What follows are excerpts of that conversation. SE: Several years ago, no one was thinking about on-chip monitoring. What's changed? Cohen: Today it is obvious that a solution is needed for optimizing performanc... » read more

Multi-Die Integration
By Ed Sperling - 04 Jan, 2023 - Comments: 0

Putting multiple heterogeneous chips is the way forward for improved performance and more functionality, but it also brings a host of new challenges around partitioning, layout, and thermal. Michael Posner, senior director for die-to-die connectivity at Synopsys, talks about the advantages of 3D integration, why it’s finally going mainstream, and what’s needed in the EDA tools to make this ... » read more

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