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Week In Review: Manufacturing, Test


Chipmakers Intel has outlined its new process technology roadmap with plans to regain the leadership position in the market. As part of the move, Intel has changed the way it designates the nodes, revealed its new gate-all-around (GAA) transistor, and disclosed a customer for the GAA technology--Qualcomm. And not to be outdone, Intel has broadened its packaging portfolio. Intel is changing ... » read more

Geo-Spatial Outlier Detection


Comparing die test results with other die on a wafer helps identify outliers, but combining that data with the exact location of an outlier offers a much deeper understanding of what can go wrong and why. The main idea in outlier detection is to find something in or on a die that is different from all the other dies on a wafer. Doing this in the context of a die’s neighbor has become easie... » read more

Week In Review: Manufacturing, Test


Chipmakers The chip industry is buzzing over a Wall Street Journal report that Intel is in talks to buy GlobalFoundries (GF) for $30 billion. In March, Intel re-entered the foundry business, positioning itself against Samsung and TSMC at the leading edge, and against a multitude of foundries working at older nodes. Intel planned to jumpstart its foundry business within its own fabs. But it... » read more

Week In Review: Auto, Security, Pervasive Computing


Security A new security annotation standard for hardware IP is now available for download at no cost. The board of directors of the Accellera Systems Initiative, the non-profit EDA- and IP-standards organization, approved the release of the Security Annotation for Electronic Design Integration (SA-EDI) Standard 1.0. The standard, developed by Accellera’s IP Security Assurance (IPSA) Working ... » read more

Week In Review: Manufacturing, Test


Chipmakers and OEMs China has been working on compound semiconductors, such as gallium-nitride (GaN) and silicon carbide (SiC). Now, a China-backed company has taken a big step in the SiC and related markets. Chip supplier Nexperia, a subsidiary of China’s Wingtech Technology, has acquired Newport Wafer Fab (NWF), a U.K.-based manufacture of power and compound semiconductors, including Si... » read more

5G Chips Add Test Challenges


The advent of chips supporting millimeter-wave (mmWave) 5G signals is creating a new set of design and testing challenges. Effects that could be ignored at lower frequencies are now important. Performing high-volume test of RF chips will require much more from automated test equipment (ATE) than is required for chips operating below 6 GHz. “MmWave design is a pretty old thing,” said Y... » read more

Cleaning Up During IC Test


Test is a dirty business. It can contaminate a unit or wafer, or the test hardware, which in turn can cause problems in the field. While this has not gone unnoticed, particularly as costs rise due to increasing pin and ball density, and as more chips are bundled together in a package, the cost of dirt continues to be a focus. Cleaning recipes for test interface boards are changing, and analy... » read more

Development Of High Voltage General-Purpose Pin-Electronics


Currently, there is a demand in Automated Test Equipment (ATE) to test both high-speed/low-voltage amplitude devices manufactured in advanced processes and low-speed / high-voltage amplitude devices manufactured in legacy processes by a pin-electronics equipment. However, it is difficult to achieve both the operating speed over than 1Gbps and the wide I/O range over than 10Vpp, due to the trade... » read more

Driving Toward Predictive Analytics With Dynamic Parametric Test


The foundation of parametric test within semiconductor manufacturing is its usefulness in determining that wafers have been fabricated properly. Foundries use parametric test results to help verify that wafers can be delivered to a customer. For IDMs, the test determines whether the wafers can be sent on for sorting. Usually inserted into the semiconductor manufacturing flow during wafer fabric... » read more

Week In Review: Manufacturing, Test


Chipmakers and OEMs More delays and product woes at Intel. “INTC disclosed that it is delaying the launch of its next-generation Xeon server processor Sapphire Rapids (10nm) from the end of this year to 1Q22 due to additional validation needed for the chip,” said John Vinh, an analyst at KeyBanc, in a research note. “Production is expected to begin in 1Q22, with the ramp expected to begi... » read more

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