tag: Advantest

Hidden Costs And Tradeoffs In IC Quality
By Gregory Haley - 08 Feb, 2024 - Comments: 0

Balancing reliability against cost is becoming more difficult for semiconductor test, as chip complexity increases and devices become more domain-specific. Tests need to be efficient and effective without breaking the bank, while also ensuring chips are of sufficient quality for their specific application. The problem is that every new IC device adds its own set of challenges, from smaller f... » read more

True Zero Trust Combats IC Manufacturing Security Challenges
By Michael Chang - 08 Feb, 2024 - Comments: 0

The semiconductor manufacturing industry is facing a host of unprecedented technology and security challenges. A common catchphrase these days is that “data is the new oil.” Data is everywhere, in everything we do, and there is both good and bad associated with this trend. Data everywhere creates new security issues that need to be addressed to protect the integrity of your information and ... » read more

Blog Review: Jan. 10
By Liz Allan - 10 Jan, 2024 - Comments: 0

Keysight’s Jenn Mullen explains how ChatGPT’s tools can help quality assurance (QA) engineers and software testers overcome test automation debt, and become more productive and able to deliver consistently high-quality products to market faster. Siemens’ Keith Felton discusses how the paradigm of “shift-left” power delivery analysis has emerged as a critical methodology in addressi... » read more

Glass Substrates Gain Foothold In Advanced Packages
By Gregory Haley - 09 Jan, 2024 - Comments: 0

Glass substrates are starting to gain traction in advanced packages, fueled by the potential for denser routing and higher signal performance than the organic substrates used today. There are still plenty of problems to solve before this approach becomes mainstream. While glass itself is cheap and shares some important physical similarities to silicon, there are challenges with buildup, stre... » read more

Plugging Gaps In The IC Supply Chain
By Anne Meixner - 09 Jan, 2024 - Comments: 0

Multiple touch points in manufacturing and packaging are exposing gaps in the data used to track different components, making it difficult to identify the source of issues that can affect yield and reliability, and opening the door to counterfeit or sub-standard parts. This involves more than just assigning a simple identifying code to a chip. At different points in a device's lifecycle, new... » read more

Meeting The Test Challenges Of Ultra-Wideband Chipsets
By Kevin Yan - 09 Jan, 2024 - Comments: 0

By Kevin Yan and Daniel Sun This article is adapted from a paper and presentation at SEMICON China, March 2023. Ultra-wideband (UWB) technology, as defined by IEEE 802.15.4 and 802.15.4z standards, enables short-range, low-power RF location-based services and wireless communication. A variety of devices have reached the market to help implement UWB capability, but these devices present si... » read more

Unlocking Value: The Power of AI in Semiconductor Test
By Advantest - 09 Jan, 2024 - Comments: 0

AI (Artificial Intelligence) and data analytics empower semiconductor manufacturers to extract valuable insights from the massive amounts of data generated throughout the silicon lifecycle. By leveraging AI algorithms, semiconductor manufacturers can optimize silicon design, assembly, and testing processes. Through the analysis of vast datasets, AI can identify patterns, predict failures, and o... » read more

Chip Industry Week In Review
By The SE Staff - 05 Jan, 2024 - Comments: 0

By Susan Rambo, Jesse Allen, and Liz Allan The U.S. government will provide about $162 million in federal incentives, under the CHIPS and Science Act, to help Microchip onshore its semiconductor supply chain. The move is aimed at securing a reliable domestic supply of MCUs and mature-node chips. “Today’s announcement will help propel semiconductor manufacturing projects in Colorado and O... » read more

Chip Industry Week In Review
By The SE Staff - 22 Dec, 2023 - Comments: 0

By Jesse Allen, Karen Heyman, and Liz Allan More than 1 billion generative AI smartphones are expected be shipped during 2024 to 2027, reports Counterpoint. The share of GenAI smartphones will be 4% of the market in 2023 and is likely to double in 2024, with Samsung capturing half the market, followed by Chinese OEMs. By 2027, GenAI smartphones could account for 40% of the market. Global ... » read more

Proprietary Vs. Commercial Chiplets
By Ed Sperling - 19 Dec, 2023 - Comments: 0

Large chipmakers are focusing on chiplets as the best path forward for integrating more functions into electronic devices. The challenge now is how to pull the rest of the chip industry along, creating a marketplace for third-party chiplets that can be chosen from a menu using specific criteria that can speed time to market, help to control costs, and behave as reliably as chiplets developed in... » read more

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