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How AI/ML Improves Fab Operations


Chip shortages are forcing fabs and OSATs to maximize capacity and assess how much benefit AI and machine learning can provide. This is particularly important in light of the growth projections by market analysts. The chip manufacturing industry is expected to double in size over the next five years, and collective improvements in factories, AI databases, and tools will be essential for doub... » read more

Harnessing The Power Of Data In Semiconductor Test


Every day, new methods are being developed to harvest, cleanse, integrate, and analyze data sources and extract from them useful, actionable intelligence to aid decision-making and other processes. This is true for a variety of industries, including semiconductor design, manufacturing, and test. Moore’s Law (figure 1) may be slowing with respect to traditional scaling of transistor critica... » read more

Week In Review: Manufacturing, Test


It's earnings season, and despite widespread reports of capacity issues and shortages, the chip industry turned in relatively solid results across the board. Intel exceeded January guidance for Q1, reporting first-quarter GAAP revenue of $18.4 billion, a 7% year-over-year decrease, and a 1% decrease year-over-year on non-GAAP basis. Record revenue was achieved in the Network and Edge Group, ... » read more

Week In Review: Manufacturing, Test


Photonic Chips Go Big In Europe PhotonDelta, a collaborative end-to-end supply chain for the application of photonics chips, secured €1.1 billion in conditional funding for a six-year initiative. Investments from the Netherlands government and other organizations “will be used to build 200 startups, scale up production, create new applications for photonic chips, and develop infrastructure... » read more

Week In Review: Auto, Security, Pervasive Computing


Automotive, mobility An engine-sensor malfunction in three popular Japanese-versions of the Subaru models has forced the company to suspend production temporarily in Japan, according to Reuters. The sensor in the CB18 engine, found in Japan’s Forester, Outback, and Levor cars, stops the engine from starting and flashes a warning light. In North America, Subaru is adding a wide-angle mono cam... » read more

Finding And Applying Domain Expertise In IC Analytics


Behind PowerPoint slides depicting the data inputs and outputs of a data analytics platform belies the complexity, effort, and expertise that improve fab yield. With the tsunami of data collected for semiconductor devices, fabs need engineers with domain expertise to effectively manage the data and to correctly learn from the data. Naively analyzing a data set can lead to an uninteresting an... » read more

Week In Review: Manufacturing, Test


Deals AMD plans to purchase cloud startup Pensando for about US $1.9 billion. In a presentation at the SEMI ISS conference this week, AMD CTO Mark Papermaster described Pensando's technology as a "highly programmable packet-processing engine that allows you to speed up systems designed for the data center." Intel, Micron, Analog Devices and MITRE Engenuity formed an alliance to accelerate c... » read more

Week In Review: Manufacturing, Test


Worldwide fab equipment spending for front-end manufacturing is expected to hit $107 billion this year, an 18% year-over-year increase, according to SEMI’s latest World Fab Forecast report. “Crossing the $100 billion mark in spending on global fab equipment for the first time is a historic milestone for the semiconductor industry,” said Ajit Manocha, president and CEO of SEMI. Investme... » read more

Survey: 2022 Deep Learning Applications


The 2022 member list of deep learning projects and products that eBeam members are working on in photomask to wafer semiconductor manufacturing. Participating companies include Advantest, ASML, Canon, CEA-LETI, D2S, Fraunhofer IPMS, Hitachi High-Tech Corporation, imec, NuFlare Technology, Siemens Industries Software, Inc.; Siemens EDA, STMicroelectronics, and TASMIT. Click here to see the su... » read more

Fundamental Shifts In IC Manufacturing Processes


High chip value and 3D packaging are changing where and how tests are performed, tightening design-for-reliability and accelerating the shift of tools from lab to fab. Heterogeneous integration and more domain-specific designs are causing a string of disruptions for chip manufacturers, up-ending proven fab processes and methodologies, extending the time it takes to manufacture a chip, and ul... » read more

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