Author's Latest Posts


Singulated Die Test Ensures Stacked Die Quality As Power Density Rises


The accelerating rate at which the industry adopts new process nodes is posing critical test challenges. Shrinking geometries combined with increased design complexity with respect to metrics such as gates per square micrometer, plus higher operating frequencies, are leading to ever higher levels of power density. The resulting device thermal excursions are driving the need for singulated die t... » read more

Early Detection Of C-RES Degradation On High-Current Power Planes


Probe-card or device contactor damage can be dramatic and catastrophic, with yield dropping drastically very quickly. What is not dramatic is the hypothesized slow probe needle or contactor degradation process that might precede catastrophic failure. Such degradation is difficult to detect in the early stages, when probe cards, die, and packages continue to yield normally. A key goal is to dete... » read more