tag: AEI

How Overlay Keeps Pace With EUV Patterning
By Laura Peters - 09 Aug, 2022 - Comments: 1

Overlay metrology tools improve accuracy while delivering acceptable throughput, addressing competing requirements in increasingly complex devices. In a race that never ends, on-product overlay tolerances for leading-edge devices are shrinking rapidly. They are in the single-digit nanometer range for the 3nm generation (22nm metal pitch) devices. New overlay targets, machine learning, and im... » read more

Impact Of EUV Resist Thickness On Local Critical Dimension Uniformities For <30nm CD Via Patterning
By Coventor - 21 Oct, 2020 - Comments: 0

This paper describes the impact of extreme ultraviolet (EUV) resist thickness on <30 nm via local critical dimension uniformity (LCDU) measured during after development inspection (ADI) and after etch inspection (AEI). For the same post-etch CD targets, increasing resist thickness from 40 to 60 nm helped reduced CD variability. This work was performed via virtual fabrication using Coventor�... » read more

The Impact Of EUV Resist Thickness On Via Patterning Uniformity
By Benjamin Vincent - 30 Mar, 2020 - Comments: 0

Via patterning at advanced nodes requires extremely low critical dimension (CD) values, typically below 30nm. Controlling these dimensions is a serious challenge, since there are many inherent sources of variation during lithography and etch processing. Coventor personnel, in conjunction with our colleagues from ASML and imec, recently looked at the impact of Extreme Ultraviolet lithography (EU... » read more

The Week In Review: IoT
By Jeff Dorsch - 11 Aug, 2017 - Comments: 0

Connectivity M1 Limited of Singapore worked with Nokia to launch a nationwide narrowband Internet of Things network, targeting such applications as asset tracking, environmental monitoring, fleet management, and smart energy management for buildings. M1 hopes to boost the IoT ecosystem in Singapore with the new NB-IoT network. M&A DuPont has agreed to acquire Granular, a provider of digita... » read more

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