Step Towards 3D PICs: Low Loss Fiber-Coupled Interconnects (UIUC)


A new technical paper titled "Low loss fiber-coupled volumetric interconnects fabricated via direct laser writing" was published by researchers at University of Illinois Urbana-Champaign (UIUC). Abstract "Photonic integrated circuits (PICs) are vital for high-speed data transmission. However, optical routing is limited in PICs composed of only one or a few stacked planes. Further, coupling ... » read more

Telecare Challenges: Secure, Reliable, Lower Power


The adoption of telecare using a variety of connected digital devices is opening the door to much more rapid response to medical emergencies, as well as more consistent monitoring, but it also is adding new challenges involving connectivity, security, and power consumption. Telecare has been on the horizon for the better part of two decades, but it really began ramping with improvements in s... » read more