2023: A Good Year For Semiconductors

By Brian Bailey - 21 Dec, 2023 - Comments: 0

Looking back, 2023 has had more than its fair share of surprises, but who were the winners and losers? The good news is that by the end of the year, almost everyone was happy. That is not how we exited 2022, where there was overcapacity, inventories had built up in many parts of the industry, and few sectors — apart from data centers — were seeing much growth. The supposed new leaders we... » read more

Fabs Begin Ramping Up Machine Learning

By Anne Meixner - 19 Dec, 2023 - Comments: 0

Fabs are beginning to deploy machine learning models to drill deep into complex processes, leveraging both vast compute power and significant advances in ML. All of this is necessary as dimensions shrink and complexity increases with new materials and structures, processes, and packaging options, and as demand for reliability increases. Building robust models requires training the algorithms... » read more

Data Formats For Inference On The Edge

By Brian Bailey - 14 Dec, 2023 - Comments: 0

AI/ML training traditionally has been performed using floating point data formats, primarily because that is what was available. But this usually isn't a viable option for inference on the edge, where more compact data formats are needed to reduce area and power. Compact data formats use less space, which is important in edge devices, but the bigger concern is the power needed to move around... » read more

Requirements For The Efficient Implementation Of AI Solutions On Edge Devices

By André Schneider - 14 Dec, 2023 - Comments: 0

By André Schneider, Olaf Enge-Rosenblatt, and Björn Zeugmann In recent years, there has been a growing tendency to implement data-driven approaches for the continuous monitoring of industrial plants as part of digitalization and Industry 4.0 initiatives. The hope is to detect critical conditions at an early stage, minimize maintenance and downtimes, and continuously achieve high product qu... » read more

The Uncertain Future Of In-Memory Compute

By Karen Heyman - 13 Dec, 2023 - Comments: 0

Experts at the Table — Part 2: Semiconductor Engineering sat down to talk about AI and the latest issues in SRAM with Tony Chan Carusone, chief technology officer at Alphawave Semi; Steve Roddy, chief marketing officer at Quadric; and Jongsin Yun, memory technologist at Siemens EDA. What follows are excerpts of that conversation. Part one of this conversation can be found here and part 3 is h... » read more

Testing ICs Faster, Sooner, And Better

By Laura Peters - 12 Dec, 2023 - Comments: 0

The infrastructure around semiconductor testing is changing as companies build systems capable of managing big data, utilizing real-time data streams and analysis to reduce escape rates on complex IC devices. At the heart of these tooling and operational changes is the need to solve infant mortality issues faster, and to catch latent failures before they become reliability problems in the fi... » read more

AI Races To The Edge

By Karen Heyman - 07 Dec, 2023 - Comments: 0

AI is becoming increasingly sophisticated and pervasive at the edge, pushing into new application areas and even taking on some of the algorithm training that has been done almost exclusively in large data centers using massive sets of data. There are several key changes behind this shift. The first involves new chip architectures that are focused on processing, moving, and storing data more... » read more

The Evolution Of Generative AI Up To The Model-Driven Era

By Steve Brown - 07 Dec, 2023 - Comments: 0

Generative AI has become a buzzword in 2023 with the explosive proliferation of ChatGPT and large language models (LLMs). This brought about a debate about which is trained on the largest number of parameters. It also expanded awareness of the broader training of models for specific applications. Therefore, it is unsurprising that an association has developed between the term “Generative AI�... » read more

Advanced DFT And Silicon Bring-Up For AI Chips

By Lee Harrison - 07 Dec, 2023 - Comments: 0

The AI market is growing quickly, spurring an insatiable demand for powerful AI accelerators. AI chip makers are pressed with aggressive time-to-market goals and need the tools to help them get their chips into the hands of customers as quickly as possible. IC test and silicon bring-up are tasks that can affect both the quality and the time-to-market of AI chips. Different companies are usin... » read more

Use Advanced DFT And Silicon Bring Up To Accelerate AI Chip Design

By Siemens EDA - 07 Dec, 2023 - Comments: 0

The market for AI chips is growing quickly, with the 2022 revenue of $20B expected to grow to over $300B by 2030. To keep up with the demand and stay competitive, AI chip designers set aggressive time-to-market goals. Design teams looking for ways to shave significant time off chip development time can look to advanced DFT and silicon bring up techniques described in this paper, including hiera... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

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