Redefining XPU Memory For AI Data Centers Through Custom HBM4: Part 2


This is the second in a three-part series from Alphawave Semi on HBM4 and gives insights into HBM implementation challenges. Click here for part 1, for an overview on HBM, and in part 3, we will introduce details of a custom HBM implementation. Implementing a 2.5D System-in-Package (SiP) with High Bandwidth Memory (HBM) is a complex process that spans across architecture definition, designi... » read more

Enhancing Compute Security Architecture For New-Age Applications


New-age AI-powered applications are becoming increasingly essential in our daily lives. Continuing to do so requires that these applications and services meet three primary challenges: Achieving high performance for complex compute tasks. Ensuring cost-effectiveness and seamless integration with existing infrastructure. Maintaining robust security and privacy measures. Historicall... » read more

The Future Of Technology: Generative AI In China


China's investment in Gen-AI is projected to surge with an estimated 86% CAGR over the next five years. This growth is driven by a focus on technological self-sufficiency, from applications to chips, and a strong emphasis on locally developed technology. Key areas of development include: AI Chip Development: Addressing the need for powerful AI infrastructure. Dataset Localization: S... » read more

Advancing AI At The IoT Edge


In a highly connected world, there is a need for more intelligent and secure computation locally and preferably on the very devices that capture data, whether it be raw or compressed video, images, or voice. End markets continue to expect compute costs to trend down, at a time when computation demands are increasing, as is evident from recently popularized AI paradigms such as large language mo... » read more

Tools Needed To Track, Catalog Hardware Vulnerabilities


Monitoring for cyberattacks is a key component of hardware-based security, but what happens afterward is equally important. Logging and cataloging identified hardware vulnerabilities to ensure they are not repeated is essential for security. In fact, thousands of weak points have been identified as part of the chip design process, and even posted publicly online. Nevertheless, many companies... » read more

The Evolution of HBM


High-bandwidth memory originally was conceived as a way to increase capacity in memory attached to a 2.5D package. It has since become a staple for all high-performance computing, in some cases replacing SRAM for L3 cache. Archana Cheruliyil, senior product marketing manager at Alphawave Semi, talks about how and where HBM is used today, how it will be used in the future, why it is essential fo... » read more

Aging, Complexity, And AI In Analog Design


Experts at the Table: Semiconductor Engineering sat down to discuss abstraction in analog vs. digital, how analog circuits age, the growing role of AI, and why there is so much margin in analog designs, with Mo Faisal, president and CEO of Movellus; Hany Elhak, executive director of product management at Synopsys; Cedric Pujol, product manager at Keysight; and Pradeep Thiagarajan, principal pro... » read more

Critical Design Considerations For High-Bandwidth Chiplet Interconnects (TSMC)


A new technical paper titled "High-Bandwidth Chiplet Interconnects for Advanced Packaging Technologies in AI/ML Applications: Challenges and Solutions" was published by researchers at TSMC. Abstract: "The demand for chiplet integration using 2.5D and 3D advanced packaging technologies has surged, driven by the exponential growth in computing performance required by Artificial Intelligence a... » read more

Goal-Driven AI


For many, the long-term dream for AI within EDA is the ability to define a set of goals and tell the computer to go design it for them. A short while later, an optimized design will pop out. All of today's EDA tools will remain hidden, if they even exist at all. You would only be limited by your imagination. But we also know that AI is not to be trusted today, especially when millions of dol... » read more

Redefining XPU Memory For AI Data Centers Through Custom HBM4: Part 1


This is the first of a three-part series on HBM4 and gives an overview of the HBM standard. Part 2 will provide insights on HBM implementation challenges, and part 3 will introduce the concept of a custom HBM implementation. Relentless growth in data consumption Recent advances in deep learning have had a transformative effect on artificial intelligence (AI) and the ever-increasing volume of ... » read more

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