A New World Of Innovation

By Synopsys - 04 May, 2022 - Comments: 0

There has been a fundamental shift in product innovation. Not merely a revolution in materials or design, but a revolution of possibilities. Advanced software technologies such as artificial intelligence have given us a peek of what could be, enabled by methods to deliver the speed that turn worldchanging ideas into reality. We’ve now reached an event horizon — one where semiconductors and ... » read more

Artificial intelligence deep learning for 3D IC reliability prediction

By Technical Paper Link - 25 Apr, 2022 - Comments: 0

New research from National Yang Ming Chiao Tung University, National Center for High-Performance Computing (Taiwan), Tunghai University, MA-Tek Inc, and UCLA. Abstract "Three-dimensional integrated circuit (3D IC) technologies have been receiving much attention recently due to the near-ending of Moore’s law of minimization in 2D IC. However, the reliability of 3D IC, which is greatly infl... » read more

A Novel Power-Saving Reversing Camera System with Artificial Intelligence Object Detection

By Technical Paper Link - 20 Apr, 2022 - Comments: 1

Abstract "According to a study by the Insurance Institute for Highway Safety (IIHS), the driving collision rate of using only the reversing camera system is lower than that of using both the reversing camera system and the reversing radar. In this article, we implemented a reversing camera system with artificial intelligence object detection to increase the information of the reversing image... » read more

More Options, Less Dark Silicon

By Ed Sperling - 20 Apr, 2022 - Comments: 0

Chipmakers are beginning to re-examine how much dark silicon should be used in a heterogenous system, where it works best, and what alternatives are available — a direct result of a slowdown in Moore's Law scaling and the increasing disaggregation of SoCs. The concept of dark silicon has been around for a couple decades, but it really began taking off with the introduction of the Internet ... » read more

Speeding Up AI Algorithms

By Ed Sperling - 18 Apr, 2022 - Comments: 0

AI at the edge is very different than AI in the cloud. Salvador Alvarez, solution architect director at Flex Logix, talks about why a specialized inferencing chip with built-in programmability is more efficient and scalable than a general-purpose processor, why high-performance models are essential for getting accurate real-time results, and how low power and ambient temperatures can affect the... » read more

Architecting Faster Computers

By Brian Bailey - 14 Apr, 2022 - Comments: 3

To create faster computers, the industry must take a major step back and re-examine choices that were made half a century ago. One of the most likely approaches involves dropping demands for determinism, and this is being attempted in several different forms. Since the establishment of the von Neumann architecture for computers, small, incremental improvements have been made to architectures... » read more

Expedera: Custom Deep Learning Accelerators Through Soft-IP

By Zoya Hasan - 06 Apr, 2022 - Comments: 0

Internet of Things (IoT) and Artificial Intelligence (AI) have caused a massive increase in data generation — and along with it, a need to process data faster and more efficiently. Dubbed a “tsunami of data,” data centers are expected to consume about one-fifth of worldwide energy before 2030. This data explosion is driving a wave of startups looking to gain a foothold in custom accele... » read more

Moving Intelligence To The Edge

By Ed Sperling - 05 Apr, 2022 - Comments: 0

The buildout of the edge is driving a slew of new challenges and opportunities across the chip industry. Sailesh Chittipeddi, executive vice president at Renesas Electronics America, talks about the shift toward more AI-centric workloads rather than CPU-centric, why embedded computing is becoming the foundation of all intelligences, and the importance of software, security, and user experience ... » read more

Neuromorphic chip integrated with a large-scale integration circuit and amorphous-metal-oxide semiconductor thin-film synapse devices

By Technical Paper Link - 01 Apr, 2022 - Comments: 0

New academic paper from Nara Institute of Science and Technology (NAIST) and Ryukoku University. Abstract "Artificial intelligences are promising in future societies, and neural networks are typical technologies with the advantages such as self-organization, self-learning, parallel distributed computing, and fault tolerance, but their size and power consumption are large. Neuromorphic syste... » read more

EDA On Cloud Presents Unique Challenges

By Ann Mutschler - 31 Mar, 2022 - Comments: 0

Discussions about cloud-based EDA tools are heating up for both hardware and software engineering projects, opening the door to vast compute resources that can be scaled up and down as needed. Still, not everyone is on board with this shift, and even companies that use the cloud don't necessarily want to use it for every aspect of chip design. But the number of cloud-based EDA tools is growi... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

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