tag: AI

Unleashing AI Potential Through Advanced Chiplet Architectures
By Tony Chan Carusone - 27 Mar, 2025 - Comments: 0

The rapid proliferation of machine-generated data is driving unprecedented demand for scalable AI infrastructure, placing extreme pressure on compute and connectivity within data centers. As the power requirements and carbon footprint of AI workloads rise, there is a critical need for efficient, high-performance hardware solutions to meet growing demands. Traditional monolithic ICs will not sca... » read more

The Evolving Role Of AI In Verification
By Ann Mutschler - 26 Mar, 2025 - Comments: 0

Experts At The Table: The pressure on verification engineers to ensure the functional correctness of devices has increased exponentially as chips have gotten more complex and evolved into SoC, 3D-ICs, multi-die chiplets and beyond. Semiconductor Engineering sat down with a panel of experts, which included Josh Rensch, director of application engineering at Arteris; Matt Graham, senior group dir... » read more

Big Changes Ahead For Interposers And Substrates
By Gregory Haley - 24 Mar, 2025 - Comments: 1

Interposers and substrates are undergoing a profound transformation from intermediaries to engineered platforms responsible for power distribution, thermal management, high-density interconnects, and signal integrity in the most advanced computing systems. This shift is being driven by AI, high-performance computing (HPC), and next-generation communications, where the need for heterogeneous ... » read more

TCAD-Based AI Models For Modern Fab Workflows
By Saurabh Suryavanshi - 20 Mar, 2025 - Comments: 0

The relentless pace of semiconductor development continues unabated. Despite the slowdown in Moore’s law, feature sizes continue to shrink as new geometries come online. Constant innovations in both fab processes and device design offer new opportunities but present new challenges. As in so many other areas of electronics, artificial intelligence (AI) is starting to play a significant role. ... » read more

AI And Semiconductor In Reciprocity
By Mike Hung - 20 Mar, 2025 - Comments: 0

In today’s rapidly advancing technological era, AI has become a powerful catalyst for innovation and progress. Advanced semiconductor packaging plays a crucial role in supporting AI development, while AI applications create new semiconductor demands and drive the development of semiconductor technologies, with both complementing each other. Semiconductor packaging: The bridge between chip an... » read more

Sustainable AI Systems For Energy-Efficient Computing
By Pushkar Apte - 20 Mar, 2025 - Comments: 0

By Pushkar Apte, Jim Sexton, and Melissa Grupen-Shemansky The world is abuzz with the new opportunities being created by artificial intelligence (AI), enabled by the availability of unprecedented amounts of data. AI runs on the semiconductor engine, and in turn, creates a rising demand for semiconductor chips. The semiconductor industry is predicted to reach $1 trillion in revenue by 2030 ... » read more

Optimizing Data Movement In SoCs And Advanced Packages
By Ed Sperling - 18 Mar, 2025 - Comments: 0

The amount of data that needs to move around a chip is growing exponentially, driven by the rollout of AI and more sensors everywhere. There may be hundreds of IP blocks, more compute elements, and many more wires to contend with. Andy Nightingale, vice president of product management and marketing at Arteris, talks about the demand for low-latency on-chip communication in increasingly complex ... » read more

GPU Or ASIC For LLM Scale-Up?
By Geoff Tate - 17 Mar, 2025 - Comments: 1

The CEOs of OpenAI, Anthropic, and xAI share a strikingly similar vision — AI's progress is exponential, it will change humanity, and its impact will be greater than most people expect. This is more than just speculation. The market for AI, and its value, are real today: A human developer with GitHub CoPilot codes 55% faster with AI. GPT-4 scores 88th percentile on the LSAT vs. 50t... » read more

New Data Center Protocols Tackle AI
By Bryon Moyer - 17 Mar, 2025 - Comments: 0

Compute nodes in AI and HPC data centers increasingly need to reach out beyond the chip or package for additional resources to process growing workloads. They may commandeer other nodes in a rack (scale-up) or employ resources in other racks (scale-out). The problem is there currently is no open scale-up protocol. So far this task has been dominated by proprietary protocols, because much of ... » read more

Fulfilling 3D-IC Trade-Off Analyses (And Benefits) With An AI Assist
By Pratyush Kamal - 13 Mar, 2025 - Comments: 0

As we walk around with supercomputers in our pockets and work at desks on even more powerful supercomputers, a lot of processing has moved to the cloud. As a politician described, this can be problematic on a day when there are no clouds in the sky. The world discovered the truth of those words when Crowdstrike struck on July 19, 2024. System designers who spent years balancing power, performan... » read more

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