Using ML In EDA

By Ed Sperling - 20 Sep, 2021 - Comments: 0

Machine learning is becoming essential for designing chips due to the growing volume of data stemming from increasing density and complexity. Nick Ni, director of product marketing for AI at Xilinx, examines why machine learning is gaining traction at advanced nodes, where it’s being used today and how it will be used in the future, how quality of results compare with and without ML, and what... » read more

Deploying Artificial Intelligence At The Edge

By Pushkar Apte - 16 Sep, 2021 - Comments: 0

By Pushkar Apte and Tom Salmon Rapid advances in artificial intelligence (AI) have made this technology important for many industries, including finance, energy, healthcare, and microelectronics. AI is driving a multi-trillion-dollar global market while helping to solve some tough societal problems such as tracking the current pandemic and predicting the severity of climate-driven events lik... » read more

Tradeoffs Between Edge Vs. Cloud

By Brian Bailey - 09 Sep, 2021 - Comments: 0

Increasing amounts of processing are being done on the edge, but how the balance will change between what's computed in the cloud versus the edge remains unclear. The answer may depend as much on the value of data and other commercial reasons as on technical limitations. The pendulum has been swinging between doing all processing in the cloud to doing increasing amounts of processing at the ... » read more

On the Road To Higher Memory Bandwidth

By Frank Ferro - 09 Sep, 2021 - Comments: 0

In the decade since HBM was first announced, we’ve seen two-and-a-half generations of the standard come to market. HBM’s “wide and slow” architecture debuted first at a data rate of 1 gigabit per second (Gbps) running over a 1024-bit wide interface. The product of that data rate and that interface width provided a bandwidth of 128 gigabytes per second (GB/s). In 2016, HBM2 doubled the s... » read more

How To Maximize Your Competitiveness In The Semiconductor Industry Using Advanced DFT

By Siemens EDA - 07 Sep, 2021 - Comments: 1

Embarking on advanced SoCs without a smart design-for-test (DFT) strategy can be harmful to your bottom line. Being competitive in today’s semiconductor market means adopting integrated, scalable, and flexible solutions to cut DFT implementation time, test costs, and time-to-market. Tessent DFT technologies, developed in partnership with industry leaders, provide the most advanced DFT and yie... » read more

Fabs Drive Deeper Into Machine Learning

By Anne Meixner - 07 Sep, 2021 - Comments: 0

Advanced machine learning is beginning to make inroads into yield enhancement methodology as fabs and equipment makers seek to identify defectivity patterns in wafer images with greater accuracy and speed. Each month a wafer fabrication factory produces tens of millions of wafer-level images from inspection, metrology, and test. Engineers must analyze that data to improve yield and to reject... » read more

How Dynamic Hardware Efficiently Solves The Neural Network Complexity Problem

By Sam Fuller - 02 Sep, 2021 - Comments: 0

Given the high computational requirements of neural network models, efficient execution is paramount. When performed trillions of times per second even the tiniest inefficiencies are multiplied into large inefficiencies at the chip and system level. Because AI models continue to expand in complexity and size as they are asked to become more human-like in their (artificial) intelligence, it is c... » read more

Why TinyML Is Such A Big Deal

By Bryon Moyer - 02 Sep, 2021 - Comments: 1

While machine-learning (ML) development activity most visibly focuses on high-power solutions in the cloud or medium-powered solutions at the edge, there is another collection of activity aimed at implementing machine learning on severely resource-constrained systems. Known as TinyML, it’s both a concept and an organization — and it has acquired significant momentum over the last year or... » read more

Stepping Up To Greater Security

By Neeraj Paliwal - 02 Sep, 2021 - Comments: 0

The stakes for security grow with each passing day. The value of our data, our devices, and our network infrastructure continually increases as does our dependence on these vital resources. Reports appear weekly, and often daily, that describe security vulnerabilities in deployments. There is a steady drumbeat of successful attacks on systems that were assumed to be protecting infrastructure, i... » read more

New Approaches For Processor Architectures

By Ed Sperling - 26 Aug, 2021 - Comments: 0

Processor vendors are starting to emphasize microarchitectural improvements and data movement over process node scaling, setting the stage for much bigger performance gains in devices that narrowly target what end users are trying to accomplish. The changes are a recognition that domain specificity, and the ability to adjust or adapt designs to unique workloads, are now the best way to impro... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

New AI Processors Architectures Balance Speed With Efficiency

Hot Chips 24: Large language models ratchet up pressure for sustainable computing and heterogeneous integration; data management becomes key differentiator.