tag: AI

Capturing Knowledge Within LLMs
By Brian Bailey - 25 Jul, 2024 - Comments: 0

At DAC this year, there was a lot of talk about AI and the impact it is likely to have. While EDA companies have been using it for optimization and improving iteration loops within the flow, the end users have been concentrating on how to use it to improve the user interface between engineers and tools. The feedback is very positive. Large language models (LLMs) have been trained on a huge a... » read more

Will AI Disrupt EDA?
By Brian Bailey - 25 Jul, 2024 - Comments: 1

Generative AI has disrupted search, it is transforming the computing landscape, and now it's threatening to disrupt EDA. But despite the buzz and the broad pronouncements of radical changes ahead, it remains unclear where it will have impact and how deep any changes will be. EDA has two primary roles — automation and optimization. Many of the optimization problems are NP hard, which means ... » read more

Insights From The AI Hardware & Edge AI Summit
By Ashish Darbari - 25 Jul, 2024 - Comments: 0

By Ashish Darbari, Fabiana Muto, and Nicky Khodadad In today's rapidly changing technology landscape, artificial intelligence (AI) is more than a buzzword. It is transforming businesses and societies. From advances in scalable AI methodology to urgent calls for sustainability, the AI Hardware & Edge AI Summit recently held in London, sparked vibrant discussions that will determine the fu... » read more

ConvNext Runs 28X Faster Than Fallback
By Steve Roddy - 22 Jul, 2024 - Comments: 0

Two months ago in our blog we highlighted the fallacy of using a conventional NPU accelerator paired with a DSP or CPU for “fallback” operations. (Fallback Fails Spectacularly, May 2024). In that blog we calculated what the expected performance would be for a system with a DSP needing to perform the new operations found in one of today’s leading new ML networks – ConvNext. The result wa... » read more

PCIe 7.0: Speed, Flexibility & Efficiency For The AI Era
By Lou Ternullo - 18 Jul, 2024 - Comments: 0

As the industry came together for PCI-SIG DevCon last month, one thing took center stage, and that was PCI Express 7.0. While still in the final stages of development, the world is certainly ready for this significant new milestone of the PCIe specification. Let’s look at how PCIe 7.0 is poised to address the escalating demands of AI, high-performance computing, and emerging data-intensive ap... » read more

On-Device Speaker Identification For Digital Television (DTV)
By Marcus Corbin - 18 Jul, 2024 - Comments: 0

In recent years, the way we interact with our TVs has changed. Multiple button presses to navigate an on-screen keyboard have been replaced with direct interaction through our voices. While this has resulted in significant improvements to the Digital Television (DTV) user experience, more can be done to provide immersive and engaging experiences. Imagine you say, “recommend me a film” or... » read more

Managing kW Power Budgets
By Ed Sperling - 17 Jul, 2024 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss increasing power demands and how to address it with Hans Yeager, senior principal engineer, architecture, at Tenstorrent; Joe Davis, senior director for Calibre interfaces and EM/IR product management at Siemens EDA; Mo Faisal, CEO of Movellus; Trey Roessig, CTO and senior vice president of engineering at Empower Semiconductor.... » read more

6G And Beyond: Overall Vision And Survey of Research
By Technical Paper Link - 16 Jul, 2024 - Comments: 0

A new 92 page technical paper titled "6G: The Intelligent Network of Everything -- A Comprehensive Vision, Survey, and Tutorial" was published by IEEE researchers at Finland's University of Oulu. Abstract "The global 6G vision has taken its shape after years of international research and development efforts. This work culminated in ITU-R's Recommendation on "IMT-2030 Framework". While the d... » read more

Intel Vs. Samsung Vs. TSMC
By Ed Sperling - 15 Jul, 2024 - Comments: 3

The three leading-edge foundries — Intel, Samsung, and TSMC — have started filling in some key pieces in their roadmaps, adding aggressive delivery dates for future generations of chip technology and setting the stage for significant improvements in performance with faster delivery time for custom designs. Unlike in the past, when a single industry roadmap dictated how to get to the next... » read more

Delivering On Power During HPC Test
By Anne Meixner - 09 Jul, 2024 - Comments: 0

The industry’s insatiable need for power in high-performance computing (HPC) is creating problems for test cells, which need to deliver very high currents at very consistent voltage levels through the power delivery network (PDN). In response, ATE, wafer probe, and contactor vendors are introducing some innovative approaches and test procedures that can ensure robust power delivery to ATE pro... » read more

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