tag: Amkor

Meeting Cost And Technology Requirements Using MLF/QFN
By Amkor - 14 Dec, 2022 - Comments: 0

MicroLeadFrame (MLF)/ quad flat no-lead (QFN) packaging technology is the fastest growing IC packaging solution today. From a market segment perspective, MLF packaging solutions represent more than a 111B-unit market for 2022 across five markets: automotive, consumer, industrial, networking, and communications (Figure 1). The package solution requirements across these markets vary but, the fund... » read more

The Rise Of Copper Wires In Automotive ICs
By Prasad Dhond - 17 Nov, 2022 - Comments: 0

In 2011, the price of Gold (Au) surged to $1900/oz which had a drastic impact on Wirebonded ICs using Au wires. IC suppliers scrambled to convert from Au to copper (Cu) wire on as many products as they could. However, automotive ICs were reluctant to make the jump due to lack of reliability data and performance track-record. However, today’s automotive ICs are big users of Cu wires driven by ... » read more

Hot Trends In Semiconductor Thermal Management
By Karen Heyman - 17 Nov, 2022 - Comments: 1

Increasing thermal challenges, as the industry moves into 3D packaging and continues to scale digital logic, are pushing the limits of R&D. The basic physics of having too much heat trapped in too small a space is leading to tangible problems, like consumer products that are too hot to hold. Far worse, however, is the loss of power and reliability, as overheated DRAM has to continually r... » read more

Where All The Semiconductor Investments Are Going
By Ed Sperling - 17 Nov, 2022 - Comments: 2

Companies and countries are funneling huge sums of money into semiconductor manufacturing, materials, and research — at least a half-trillion dollars over the next decade, and maybe much more — to guarantee a steady supply of chips and know-how to support growth across a wide swath of increasingly data-centric industries. The build-out of a duplicate supply chain that can guarantee capac... » read more

Week In Review: Semiconductor Manufacturing, Test
By Karen Heyman - 11 Nov, 2022 - Comments: 0

U.S. President Joe Biden appears ready to increase pressure on Japan and the Netherlands to help block the flow of advanced chip technology to China, where it can be used to develop cutting-edge weapons. "You will see Japan and Netherlands follow our lead," U.S. Commerce Secretary Gina Raimondo told CNBC. Japan plans to budget ¥350 billion ($2.38 billion) in a research collaboration with th... » read more

Test Connections Clean Up With Real-Time Maintenance
By Anne Meixner - 08 Nov, 2022 - Comments: 0

Test facilities are beginning to implement real-time maintenance, rather than scheduled maintenance, to reduce manufacturing costs and boost product yield. Adaptive cleaning of probe needles and test sockets can extend equipment lifetimes and reduce yield excursions. The same is true for load board repair, which is moving toward predictive maintenance. But this change is much more complicate... » read more

Chip Industry Earnings: A Mixed Bag
By Linda Christensen - 28 Oct, 2022 - Comments: 0

Editor's Note: Updated the week of Oct. 31 and Nov. 7 for additional earnings releases. Although most companies reported revenue growth, this latest round of chip industry earnings releases reflected a few major themes: Lower future quarter guidance to varying degrees, due to the recent U.S. export restrictions related to China; Negative impact of the inflationary environment on corn... » read more

Week In Review: Semiconductor Manufacturing, Test
By Karen Heyman - 28 Oct, 2022 - Comments: 0

This week saw more fallout from U.S. export controls: SK hynix may consider selling its memory chip production facilities in China if recently imposed controls make it too difficult to continue operations there, according to Nikkei Asia. "As a contingency plan, we are considering selling the fab, selling the equipment or transferring the equipment to South Korea," said Kevin Noh, SK hynix ... » read more

SiPs: The Best Things in Small Packages
By Laura Peters - 20 Oct, 2022 - Comments: 0

System-in-package (SiP) is quickly emerging as the package option of choice for a growing number of applications and markets, setting off a frenzy of activity around new materials, methodologies, and processes. SiP is an essential packaging platform that integrates multiple functionalities onto a single substrate, which enables lower system cost, design flexibility, and superior electrical p... » read more

Production Testing Of Discrete Power Products
By Vineet Pancholi - 20 Oct, 2022 - Comments: 0

By Vineet Pancholi and Dennis Dinawanao Metal Oxide Silicon Field Effect Transistors (MOSFETs), Insulated Gate Bipolar Transistors (IGBTs), Bipolar Junction Transistors (BJTs), diodes, and application specific multi-transistor packaged modules are some of the more popular discrete products. Switches control the flow of current within a circuit. MOSFETs are a building block of most electronic... » read more

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