Blog Review: Nov. 4


Can agile methodologies typically used in software development bring more efficiency to chip design? For UC Berkeley Professor Borivoje Nikolic, the answer is, why not? Christine Young reports on the keynote at Cadence's Mixed-Signal Technology Summit. For his latest embedded video, Mentor's Colin Walls focuses the camera on language standardization and use of language extensions. Ansys' ... » read more

Hybrid Emulation Gets More Hybrid


Rising chip complexity is creating a booming emulation business, as chipmakers working at advanced nodes turn to bigger iron to get chips out the door on time. What started as a "shift lift"—doing more things earlier in the design cycle—is evolving into a more complex mix of hardware-accelerated verification for both hardware and software. There are even some new forays into power explor... » read more

Blog Review: Oct. 28


Get up to date on the latest USB 3.1 happenings with Synopsys' Eric Huang, including the first laptops shipping with the Type C connector, the importance of USB safety, and price cuts on chips from Intel and ASMedia. The connected car is ready to hit the mass market, according to automakers, but customer adoption has been slow. Mentor's John Day takes a look at a report from the TU-Detroit c... » read more

Blog Review: Oct. 21


Ansys' Bill Vandermark goes back to the future in this week's top five picks. Plus, the star of the world's longest hoverboard flight gets an upgrade. Perhaps the person riding it will be wearing an ocean-cleaning bikini. Straight from MemCon 2015, Rambus' Aharon Etengoff brings us a keynote exploring the increasingly blurred lines between memory and storage, and how an alternative paradigm ... » read more

Accurate Thermal Analysis, Including Thermal Coupling Of On-Chip Hot Interconnect


Driven by rapid advancement in mobile/server computing and automotive/communications, SoCs are experiencing a fast pace of functional integration along with technology scaling. Advanced low power techniques are widely used, while meeting higher performance requirements using a variety of packaging technologies. The Internet of Things (IoT) is further opening up new applications with connected d... » read more

Blog Review: Oct. 14


Rambus' Aharon Etengoff explores how new optical interfaces are aiding the burgeoning field of optogenetics, which combines genetic targeting of specific neurons or proteins with optical technology to study living neural circuits. Anand Shirahatti, Divyang Mali, and Naveen G of Synopsys team up to explain three features that make the MIPI UniPro mobile interconnect stand out, along with the ... » read more

Blog Review: Oct. 7


Ansys' Sunil Nakum takes a look at backing up the brain and concludes that we would need to keep following Moore's Law for a long time given the current approaches and leave several questions unanswered. There is a battle brewing between high-efficiency LED lighting and vintage-style Edison bulbs. With the latest lighting fad, Mentor's John McMillan asks, is style and nostalgia beating high-... » read more

Power Estimation: Early Warning System Or False Alarm?


Semiconductor Engineering sat down with a large panel of experts to discuss the state of power estimation and to find out if the current levels of accuracy are sufficient to being able to make informed decisions. Panelists included: Leah Schuth, director of technical marketing in the physical design group at [getentity id="22186" comment="ARM"]; Vic Kularni, senior vice president and general ma... » read more

Blog Review: Sept. 30


In an increasingly networked world, NXP's Lars Reger advocates for a change of perspective: one which places data protection and the security of end customers and users at the heart. Differential power analysis has been on the mind of Rambus' Aharon Etengoff recently as increasing numbers of SIM cards are being cracked, plus some counter measures that can be used. Even wondered about the ... » read more

The Price Of Consolidation


Consolidation is causing far-reaching changes across the global semiconductor ecosystem due to the size of companies being bought and the dearth of startups to replenish those being acquired. Coupled with the rising cost and difficulty of shrinking features down to advanced process nodes—many argue that is the largest driver of consolidation—the market dynamics for who's buying IP, EDA t... » read more

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