Week In Review: Design, Low Power


Arm and Intel Foundry Services inked a multi-generation agreement to enable chip designers to build Arm-based SoCs on the Intel 18A process. The initial focus is mobile SoC designs, but the deal allows for potential expansion into automotive, IoT, data center, aerospace, and government applications. IFS and Arm will undertake design technology co-optimization (DTCO) to optimize chip design and ... » read more

Week In Review: Auto, Security, Pervasive Computing


Public USB phone charging stations are now another vector that bad actors can use to plant malware and steal data on devices — known as "juice jacking," according to the United States’ Federal Communications Commission (FCC). The FCC is encouraging people to stay away from these public charging stations, found in airports and hotels, because of bad actors can install malware on the charging... » read more

Thermal Integrity Challenges Grow In 2.5D


Thermal integrity is becoming much harder to predict accurately in 2.5D and 3D-IC, creating a cascade of issues that can affect everything from how a system behaves to reliability in the field. Over the past decade, silicon interposer technology has evolved from a simple interconnect into a critical enabler for heterogeneous integration. Interposers today may contain tens of dies or chiplets... » read more

What Designers Need To Know About GAA


While only 12 years old, finFETs are reaching the end of the line. They are being supplanted by gate-all-around (GAA), starting at 3nm [1], which is expected to have a significant impact on how chips are designed. GAAs come in two main flavors today — nanosheets and nanowires. There is much confusion about nanosheets, and the difference between nanosheets and nanowires. The industry still ... » read more

How To Plan And Conduct Highly Accelerated Life Testing


Assessing the robustness of an electronic product is integral to successful design and performance. Highly accelerated life testing (HALT) is an important testing tool for this purpose, and its effectiveness can be maximized through careful planning prior to setup and detailed execution. What is HALT? HALT is the process of applying increased stressors to an electronic device to force failure... » read more

Transitioning To Photonics


Silicon photonics is undergoing a resurgence as traditional approaches for reducing power and heat become more difficult and expensive, opening the door to a whole new set of technological challenges and driving up demand for a skill set that is in short supply today. From a technology standpoint, photonics is extremely complex. Signals drift, they are modulated with heat, and structures lik... » read more

Blog Review: April 12


Cadence's Ericles Sousa describes the five critical features of automotive SoC architectures that are essential for developing the next generation of passenger vehicles. In a podcast, Siemens' Steph Chavez chats with Gerry Partida of Summit Interconnect about the difficulties in collaboration between PCB designers and manufacturers, along with best practices that designers should follow to r... » read more

Simulation Solutions For Aviation: Hybrid-Electric Propulsion Systems


The commercial aviation industry is facing the total transformation of aircraft propulsion in the coming decades. As manufacturers develop more sustainable propulsion systems and strive to reduce the environmental impact of commercial aircraft, they must design products optimized for performance and safety. Commercial aviation companies can use digital engineering solutions to do exactly that. ... » read more

Blog Review: April 5


Synopsys's Gordon Cooper argues that AI transformer models, initially developed for natural language processing such as translation and question answering, are starting to make inroads in the computer vision application landscape and changing the direction of deep-learning architectures. Siemens' Patrick Hope shows how to identify opportunities to optimize a PCB design through the creation o... » read more

Blog Review: March 29


Siemens' Heather George suggests adopting a shift-left strategy for complex designs that integrate multiple dies into a package and examines the challenges and opportunities for performing comprehensive tests on 2.5D and 3D IC designs. Synopsys' Shekhar Kapoor notes that when considering whether a system will perform as intended, techniques that work well for monolithic SoCs may not be as we... » read more

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