tag: ANSYS

PCB Design Rules For Electromagnetic Compatibility
By Nikhil Grover - 08 Apr, 2021 - Comments: 0

When it comes to electromagnetic interference (EMI) and printed circuit boards (PCBs), rules are not meant to be broken. Following some simple guidelines for electromagnetic compatibility when designing PCBs will save time and costs. Simulation software can help. All high-speed signals on a PCB should be referenced to a solid plane. A current flowing in any trace on a PCB must complete the e... » read more

6 Steps To Successful Board Level Reliability Testing
By Ansys - 07 Apr, 2021 - Comments: 0

For semiconductor manufacturers entering the automotive environment, the lack of universal qualifications standards often leads to inconsistent reliability expectations. The most efficient solution is to establish a robust and thorough BLR testing plan that is uniquely designed for a specific manufacturer validated by a broad range of industry experiences. 6 Steps to Successful Board Level R... » read more

Blog Review: April 7
By Jesse Allen - 07 Apr, 2021 - Comments: 0

Cadence's Paul McLellan checks out the US National Security Commission on Artificial Intelligence report and what it recommends for funding the development of AI as well as semiconductor manufacturing and research. Siemens EDA's Ray Salemi continues exploring Python for verification and shows how to use cocotb to create a simple bus functional model and connect it to a testbench. Synopsys... » read more

How To Measure ML Model Accuracy
By Bryon Moyer - 01 Apr, 2021 - Comments: 0

Machine learning (ML) is about making predictions about new data based on old data. The quality of any machine-learning algorithm is ultimately determined by the quality of those predictions. However, there is no one universal way to measure that quality across all ML applications, and that has broad implications for the value and usefulness of machine learning. “Every industry, every d... » read more

Blog Review: March 31
By Jesse Allen - 31 Mar, 2021 - Comments: 0

Arm's Pavel Rudko considers several common approaches used to get better performance for neural network inference on mobile devices, such as optimizing and pruning the model and using different processing units to execute different workloads in parallel. Siemens EDA's Ray Salemi introduces basic concepts of using Python for verification and how to get Python to talk to an RTL device-under-te... » read more

Week In Review: Design, Low Power
By Jesse Allen - 26 Mar, 2021 - Comments: 0

Companies Pearl Semiconductor launched to provide low and ultra-low noise timing products. “Pearl is a timing company developing resonator-agnostic solutions. We work with quartz crystals, MEMS resonators or whatever achieves superior performance,” said Ayman Ahmed, CEO of Pearl Semiconductor. “Current and future automotive applications demand low noise and a wide operating temperatur... » read more

Waiting For Chiplet Standards
By Brian Bailey - 25 Mar, 2021 - Comments: 2

The need and desire for chiplets is increasing, but for most companies that shift will happen slowly until proven standards are in place. Interoperability and compatibility depend on many layers and segments of the supply chain coming to agreement. Unfortunately, fragmented industry requirements may lead to a plethora of solutions. Standards always have enabled increasing specialization. ... » read more

Blog Review: March 24
By Jesse Allen - 24 Mar, 2021 - Comments: 0

Arm's Brian Cline points to a project with GlobalFoundries to demonstrate the feasibility and readiness of high-density, face-to-face, wafer-bonded 3D stacking technologies for high performance, energy-efficient designs. Synopsys' Taylor Armerding warns that while supply chain security risks aren't new, the recent SolarWinds breach should make everyone pay much more attention to dependencies... » read more

Blog Review: March 17
By Jesse Allen - 17 Mar, 2021 - Comments: 0

Synopsys' Chris Clark considers the growing number of automotive sensors and the cost/performance tradeoffs between edge computing capability, sensor fusion, sensor degradation, monitoring, and the maintenance of the software over the lifespan of a vehicle. Cadence's Paul McLellan checks out how the process of loading the bootstrap into memory has changed over the years, from hand-entered on... » read more

Designing 2.5D Systems
By Brian Bailey - 15 Mar, 2021 - Comments: 0

As more designs hit the reticle limit, or suffer from decreasing yield, migrating to 2.5D designs may provide a path forward. But this kind of advanced packaging also comes with some additional challenges. How you adapt and change your design team may be determined by where your focus has been in the past, or what you are trying to achieve. There are business, organizational, and technical c... » read more

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