Securing Smart Connected Homes With OTP NVM IP

By Synopsys - 05 Feb, 2020 - Comments: 0

The market for piracy is huge and hackers have become increasingly sophisticated even when security is implemented in hardware. The race between the aggressors and protectors is a battle without end. Smart connected home devices are increasingly storing and processing very sensitive and private user data in addition to attempting to deliver copyright protected content from service providers. Pr... » read more

Embedded Non-Volatile Memory: A Newsworthy Topic

By David S. Hsu - 05 May, 2016 - Comments: 0

Hacking and security concerns for consumer electronics must be among the most newsworthy topics in the Top 10 tech stories these days. A hacking headline seems to regularly make it as the lead piece on every tech blog or news online. No doubt, then, hacking is a Top 10 concern that consumers have when purchasing their electronics devices. While no one would recommend using embedded non-vo... » read more

Memories Offer Measure Of Security For IoT Devices

By Linh Hong - 06 Jul, 2015 - Comments: 0

Consumers are going to extremes to keep their electronic devices secure. A first-person account in The New York Times offered a novel way to thwart thieves from breaking into a car with a remote keyless system and stealing it — the author kept her car keys in the freezer. As extreme as this seems, it may only get worse as we move into the era of the Internet of Things. A recent Hewlett-Pac... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: antifuse OTP

Securing Smart Connected Homes With OTP NVM IP

Embedded Non-Volatile Memory: A Newsworthy Topic

Memories Offer Measure Of Security For IoT Devices