tag: Apple

The Week In Review: Manufacturing
By Mark LaPedus - 16 Jun, 2017 - Comments: 0

Chipmakers UMC has appointed two senior vice presidents--S.C. Chien and Jason Wang--as co-presidents of the company, following Po-Wen Yen’s retirement as UMC’s CEO. The co-presidents are accountable for the overall performance of UMC. They will report to UMC Chairman Stan Hung. Chien will focus on the core manufacturing and technology aspects of UMC, including R&D and operations. Wang wil... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 09 Jun, 2017 - Comments: 0

Market research Earlier this year, the IC and equipment markets were projected to be flat. More recently, though, analysts have raised their forecast, including Pacific Crest Securities. “We are raising our 2017 capex outlook meaningfully, with the upside coming predominantly from Samsung,” said Weston Twigg, an analyst with Pacific Crest Securities, in a report. "We're raising our 2017 se... » read more

The Week In Review: IoT
By Jeff Dorsch - 09 Jun, 2017 - Comments: 0

Analysis Adam Greenfield writes about the privacy and technology issues raised by the Internet of Things in this piece, an adapted extract from his new book, "Radical Technologies: The Design of Everyday Life." “The Internet of Things presents many new possibilities, and it would be foolish to dismiss those possibilities out of hand. But we would also be wise to approach the entire domain wi... » read more

Leasing and Rental in T&M
By Jeff Dorsch - 05 Jun, 2017 - Comments: 0

Buying a high-end oscilloscope or a brand-new logic analyzer may be a tall order financially for small companies. In such cases, leasing or renting an expensive test instrument can be an affordable alternative. Having reliable test and measurement equipment is vital to product development in electronics. National Instruments has built a billion-dollar business on offering instrument hardware... » read more

SoC Design Management Software: Proprietary Vs. Open Source
By Ranjit Adhikary - 01 Jun, 2017 - Comments: 0

These days, there’s a tendency to read the word “proprietary” and think “bad,” as if whatever is proprietary is inflexible and limited capability. It’s a legacy from the emergence of open-source software, when “open” became associated with progress and “proprietary” became bad. But in many industries, proprietary solutions to this day have enormous value, deliver trust, s... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 26 May, 2017 - Comments: 0

Chipmakers Samsung has formed a new foundry division and rolled out a range of new processes. Specifically, Samsung plans to develop 8nm, 7nm, 6nm, 5nm and 4nm. It also introduced an 18nm FD-SOI technology. GlobalFoundries has provided more details about its 300mm fab plans in China. The company and the Chengdu municipality have announced an investment to develop an ecosystem for its 22nm ... » read more

Reworking Established Nodes
By Ed Sperling - 24 May, 2017 - Comments: 2

New technology markets and a flattening in smartphone growth has sparked a resurgence in older technology processes. For many of these up-and-coming applications, there is no compelling reason to migrate to the latest process node, and equipment companies and fabs are rushing to fill the void. As with all electronic devices, the focus is on cost-cutting. But because these markets are likely ... » read more

The Race To 10/7nm
By Mark LaPedus - 22 May, 2017 - Comments: 4

Amid the ongoing ramp of 16/14nm processes in the market, the industry is now gearing up for the next nodes. In fact, GlobalFoundries, Intel, Samsung and TSMC are racing each other to ship 10nm and/or 7nm technologies. The current iterations of 10nm and 7nm technologies are scaled versions of today’s 16nm/14nm finFETs with traditional copper interconnects, high-k/metal-gate and low-k diele... » read more

Moore’s Law: Toward SW-Defined Hardware
By Ed Sperling - 15 May, 2017 - Comments: 2

Pushing to the next process node will continue to be a primary driver for some chips—CPUs, FPGAs and some ASICS—but for many applications that approach is becoming less relevant as a metric for progress. Behind this change is a transition from using customized software with generic hardware, to a mix of specialized, heterogeneous hardware that can achieve better performance with less ene... » read more

Advanced Packaging Goes Mainstream
By Ed Sperling - 08 May, 2017 - Comments: 0

The roadmap for shrinking digital logic will continue for at least the next 10 years. For others devices, particularly analog, it will slow down or end. And therein lies one of the most fundamental changes in semiconductor design and manufacturing in the past half century. This is no longer just talk. Apple is using a fan-out architecture in its iPhone 7. Memory makers are stacking NAND and ... » read more

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