Disaggregation And Re-aggregation

By Ed Sperling - 02 Jul, 2012 - Comments: 0

The proliferation of platforms, subsystems and IP of any sort, as well as the move to stack die in 2.5D configurations, will force a realignment of the ecosystem. For the moment, it appears that vertically integrated companies such as Apple and Samsung have a distinct advantage. It remains to be seen just how substantial that advantage really is, however. As chips become a collection of more... » read more

The Trouble With Models

By Ed Sperling - 28 Jun, 2012 - Comments: 0

By Ann Steffora Mutschler Models and modeling concepts seem to be on the tip of every tongue these days. Once the promise of sparking true ESL design, the use of system-level models has settled into something more like enabling software development. There is also talk of leveraging models across the supply chain, but is this really possible yet? The concept of doing this incremental refinem... » read more

The Next Frontiers

By Ed Sperling - 24 May, 2012 - Comments: 0

One of the interesting things about technology is that, at least from the outside, it’s hard to tell what’s actually changing. That’s not true on the inside, of course, where radical shifts are under way. The next big push in smart phones will be much greater intelligence. In the iPhone, Siri was just the tip of the iceberg. Future versions are likely to be much more interesting. Add ... » read more

What Needs To Be Fixed

By Ed Sperling - 20 Apr, 2012 - Comments: 0

Some incredible engineering feats at the nano level—particularly below 40nm—are making their way into production chips. Even creating a sub-micron chip in the first place is a testament to the advances in semiconductor engineering. Turning off large sections of the chip and implementing techniques such as voltage and frequency scaling, power gating, multiple voltage rails and islands, multi... » read more

Experts vs. Expertise

By Ed Sperling - 08 Mar, 2012 - Comments: 0

By Ed Sperling The trend in IC design—particularly for large, complex SoCs—is specialization among engineers. There are specialists for layout, for verification, for DFM, for test, and for software, among other things. And there are experts who have a smattering of many of the pieces and can oversee the integration and testing. Power is different. Because power affects every part of a d... » read more

Converge And Consolidate

By Ed Sperling - 09 Feb, 2012 - Comments: 0

Electronics has always been about convergence, and convergence inevitably spawns new companies while forcing consolidation of others. What used to be in a device moved to a board, from a board there has been a perpetual push to put things in a chip. At one point, circa 2000, analog companies claimed that mixed signal chips were a thing of the past and that there would be separate analog chip... » read more

Ambient Computing: Interdependencies Rule

By Ed Sperling - 26 Jan, 2012 - Comments: 0

By Ann Steffora Mutschler Ambient computing: Just the concept conjures up images of a Star Trek-like ‘Computer’ that is ever at the ready, awaiting a query at any moment, and which can discern as well as perform significant tasks. While Apple’s Siri gets there partway, it is significant because the concepts that make the technology possible behind the scenes draw upon a multidisciplinary... » read more

Credit Deficit

By Ed Sperling - 09 Dec, 2011 - Comments: 0

One of the common complaints from around the semiconductor industry is that design teams don’t get recognized. Appreciation comes readily to brands such as Apple or Samsung, but it is several levels of abstraction removed from the companies that develop the processors, let alone the tools, materials, methodologies or processes that make those processors possible. Worse, energy efficiency ... » read more

Collaboration Grows

By Ed Sperling - 20 Oct, 2011 - Comments: 0

By Ed Sperling A series of recent announcements by the Big Three EDA vendors and their well-known partners from across the disaggregated SoC ecosystem is lending new credence to the impact of collaboration. While IDMs such as Apple, Intel, Samsung and IBM continue to blaze their own trail, developing in-house tools, methodologies, processes and chips, fabless companies working with foundrie... » read more

What A Difference A Decade Makes

By Tiffany Sparks - 22 Sep, 2011 - Comments: 0

By Tiffany Sparks Lately, I find myself in a reflective mood, pondering what’s changed over the past 10 years. Of course, with the 10th anniversary of 9/11 earlier this month, there’s been intense focus on what the world was like 10 years ago and what has changed since that fateful day: the thousands of lives lost, first on 9/11, then the lives lost in Afghanistan and Iraq; the geo-poli... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?