tag: Apple

Week In Review: Auto, Security, Pervasive Computing
By Marie C. Baca - 09 Sep, 2022 - Comments: 0

Automotive and mobility Seventeen U.S. states must decide whether or not to follow California's new law that mandates that all new cars, pickups and SUVs be electric or hydrogen-powered by 2035. The Clean Air Act dictates that states must follow federal guidelines unless they follow certain components of California's rules. A research firm says consumers are most passionate about a high-tec... » read more

Week In Review: Auto, Security, Pervasive Computing
By Linda Christensen - 02 Sep, 2022 - Comments: 0

The great EV ramp EV-related developments are everywhere. California’s move to ban sales of new internal-combustion vehicles by 2035, and the U.S. government’s sweeping embrace of clean-energy, are in lockstep with recent moves by the auto industry and related supply chains, as well as cutting-edge research. One of the big breakthroughs is the ability to charge an EV in 10 minutes witho... » read more

MicroLEDs Move Toward Commercialization
By Laura Peters - 29 Aug, 2022 - Comments: 1

The market for MicroLED displays is heating up, fueled by a raft of innovations in design and manufacturing that can increase yield and reduce prices, making them competitive with LCD and OLED devices. MicroLED displays are brighter and higher contrast than their predecessors, and they are more efficient. Functional prototypes have been developed for watches, AR glasses, TVs, signage, and au... » read more

Week In Review: Manufacturing, Test
By Karen Heyman - 26 Aug, 2022 - Comments: 0

Regional Shifts Supply chains are moving away from China. Apple, Honda, and Mazda are in line to diversify their manufacturing across different regions, according to one report. Another report says Apple plans to manufacture some of its new iPhone 14s in India. Mexico wants to be part of U.S.’s drive to move chip manufacturing closer to home, hosting American financiers to discuss elect... » read more

Fan-Out Packaging Gets Competitive
By Karen Heyman and Laura Peters - 18 Aug, 2022 - Comments: 0

Fan-out wafer-level packaging (FOWLP) is a key enabler in the industry shift from transistor scaling to system scaling and integration. The design fans out the chip interconnects through a redistribution layer instead of a substrate. Compared to flip-chip ball grid array (FCBGA) or wire bonds, it creates lower thermal resistance, a slimmer package, and potentially lower costs. Yet, if the h... » read more

New Uses For AI In Chips
By John Koon and Ed Sperling - 11 Aug, 2022 - Comments: 1

Artificial intelligence is being deployed across a number of new applications, from improving performance and reducing power in a wide range of end devices to spotting irregularities in data movement for security reasons. While most people are familiar with using machine learning and deep learning to distinguish between cats and dogs, emerging applications show how this capability can be use... » read more

Tradeoffs In Archiving Data
By Karen Heyman - 11 Aug, 2022 - Comments: 0

If you’ve ever had to sort through old technical documents, wondering what still has value and what can be safely tossed, you can identify with the quandary of Thomas Levy, UCSD professor of anthropology and co-founder of the field of cyber-archaeology. Staring at thousands of pieces of pottery in a Jordanian dessert, he erred on the side of keeping it all. “My personal perspective when ... » read more

A Sputnik Moment For Chips
By Ed Sperling - 02 Aug, 2022 - Comments: 5

Chip shortages are the new Sputnik moment, and they have created a sense of national and regional panic not seen since the days of the Cold War. For both the United States and Europe, those shortages have sparked some of the largest technology investments by government in the past half-century that are not strictly for the military — and by far the biggest involving semiconductors. Whi... » read more

Week In Review: Manufacturing, Test
By Karen Heyman - 29 Jul, 2022 - Comments: 1

The U.S. Congress approved the CHIPS Act, a mammoth bipartisan achievement the New York Times called “the most significant government intervention in industrial policy in decades.” As passed, the full package — now called the Chips and Science Act — contains $52 billion in direct assistance for the semiconductor industry, along with $24 billion in tax incentives. In addition, the bill c... » read more

Fab Investments Head Toward Record High
By Marie C. Baca - 27 Jul, 2022 - Comments: 0

Corporations and governments around the globe are making record-breaking investments in chip manufacturing plants amid a major push to make the semiconductor supply chain more robust and less prone to shortages caused by everything from market variations to geopolitical interruptions. These investments — which range from updating existing fabrication facilities to building entirely new fab... » read more

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