Chip Industry Week In Review

By The SE Staff - 21 Feb, 2025 - Comments: 0

The EU Commission approved €920 million in German State aid to support Infineon in setting up its Smart Power Fab in Dresden. Total funding for the Dresden site amounts to about €1 billion. PDF Solutions will acquire secureWISE for $130 million to expand the reach of its semiconductor manufacturing data platform, providing secure, remote access monitoring and control. Tariffs, trade, and ... » read more

Chip Industry Week In Review

By The SE Staff - 14 Feb, 2025 - Comments: 0

Worldwide silicon wafer shipments declined nearly 2.7% to 12,266 million square inches in 2024, with wafer revenue contracting 6.5% to $11.5 billion, according to the SEMI Silicon Manufacturers Group. CSIS released a new report, “Critical Minerals and the Future of the U.S. Economy,” with detailed analysis and policy recommendations for building a secure mineral supply chain for semicond... » read more

Universities Augment Engineering Curricula To Boost Employability

By Liz Allan - 05 Feb, 2025 - Comments: 0

Increasing numbers of universities are offering semiconductor courses in their engineering programs, and also in math, physics, and business degrees. Most universities now offer a broad foundation so students can pivot to other industries during cyclical downturns, or when technology and science create entirely new and potentially lucrative opportunities, such as generative AI, advanced pack... » read more

Global IC Fabs And Facilities Report: 2024

By Liz Allan - 21 Jan, 2025 - Comments: 0

The chip industry made significant capital investments this year to build new fabs and facilities or expand existing premises. A number of sites were dedicated to SiC, GaN, DRAM, HBM, along with packaging and assembly by OSATs, and essential gases, chemicals, and other components. More than a dozen R&D centers were also established for 8-inch wafers, EUV, and advanced packaging. Investments... » read more

NAND Flash Targets 1,000 Layers

By Bryon Moyer - 04 Dec, 2024 - Comments: 0

The chip industry is pushing to quadruple the stack height of 3D NAND flash from 200 layers to 800 layers or more over the next few years, using the additional capacity will help to feed the unending need for more memory of all types. Those additional layers will add new reliability issues a number of incremental reliability challenges, but the NAND flash industry has been steadily increasin... » read more

Chip Industry Technical Paper Roundup: Nov. 25

By Linda Christensen - 25 Nov, 2024 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=386 /] » read more

Chip Industry Week In Review

By The SE Staff - 22 Nov, 2024 - Comments: 0

SK hynix started mass production of 1-terabit 321-high NAND, with availability scheduled for the first half of next year. Rapidus will receive an additional ¥200 billion yen ($1.28B) from the Japanese government beginning in fiscal year 2025, reports Nikkei. This is on top of ¥920 billion yen ($5.98B) Rapidus has already received from the government in support of its goal to reach commer... » read more

Analysis And Design Of Dual-Layer TFTs (Oregon State Univ., Applied Materials)

By Technical Paper Link - 13 Nov, 2024 - Comments: 0

A new technical paper titled "Dual-Layer Thin-Film Transistor Analysis and Design" was published by researchers at Oregon State University and Applied Materials. Abstract "A set of analytical equations is formulated for the analysis and design of a dual-layer thin-film transistor (TFT). For a given TFT structure, in which each channel layer thickness is specified, drain current is calculate... » read more

Hybrid Bonding Makes Strides Toward Manufacturability

By Laura Peters - 28 Oct, 2024 - Comments: 0

Hybrid bonding is gaining traction in advanced packaging because it offers the shortest vertical connection between dies of similar or different functionalities, as well as better thermal, electrical and reliability results. Advantages include interconnect scaling to submicron pitches, high bandwidth, enhanced power efficiency, and better scaling relative to solder ball connections. But whil... » read more

Americas Chip Funding Energizes Industry

By Liz Allan - 23 Oct, 2024 - Comments: 0

This is the second in a series of articles tracking government chip investments. See part one here (global), part 3 covering EMEA is here and Asia here. Since the first announcement of a non-binding preliminary memorandum of terms with BAE Systems in December 2023, the U.S. Department of Commerce has rolled out comprehensive plans to support more than a dozen companies in order to shore up... » read more

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tag: Applied Materials

Chip Industry Week In Review

Chip Industry Week In Review

Universities Augment Engineering Curricula To Boost Employability

Global IC Fabs And Facilities Report: 2024

NAND Flash Targets 1,000 Layers

Chip Industry Technical Paper Roundup: Nov. 25

Chip Industry Week In Review

Analysis And Design Of Dual-Layer TFTs (Oregon State Univ., Applied Materials)

Hybrid Bonding Makes Strides Toward Manufacturability

Americas Chip Funding Energizes Industry

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