tag: Applied Materials

Blog Review: Nov. 27
By Jesse Allen - 27 Nov, 2019 - Comments: 0

Arm's Ben Fletcher digs into what's needed to make wireless 3D integration a reality from a tool to automate the design and optimization process for inductors used in wireless 3D-ICs to exploring how the data can be encoded in the transceiver to reduce power consumption. Cadence's Paul McLellan listens in as Eli Singerman of Intel explains the importance of platform security and why firmware... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 22 Nov, 2019 - Comments: 0

Chipmakers For some time, Intel has experienced supply constraints and shortages for its 14nm chip products. Apparently, the company is still having issues with both 14nm and 10nm. “Despite our best efforts, we have not yet resolved this challenge,” according to a statement from Michelle Johnston Holthaus, executive vice president and general manager of the Sales, Marketing and Communicati... » read more

DRAM Scaling Challenges Grow
By Mark LaPedus - 21 Nov, 2019 - Comments: 5

DRAM makers are pushing into the next phase of scaling, but they are facing several challenges as the memory technology approaches its physical limit. DRAM is used for main memory in systems, and today’s most advanced devices are based on roughly 18nm to 15nm processes. The physical limit for DRAM is somewhere around 10nm. There are efforts in R&D to extend the technology, and ultimate... » read more

A New Playbook For The AI Era
By Ellie Yieh - 21 Nov, 2019 - Comments: 0

It’s Q4 in Silicon Valley, which means that most tech enterprises are in strategic planning mode, taking stock of where they are today and charting a course for where they want to be over the next few years. This year’s Q4 planning cycle needs to be a little different: the opportunities before us are an order of magnitude larger. So are the challenges. To get to where we need to be, our�... » read more

Foldable Phones Bend The Limits Of Technology
By Applied Materials - 21 Nov, 2019 - Comments: 0

After years of discussion about flexible, bendable displays for mobile electronic devices, the first and most logical of these devices, foldable phones, will hit the market this year — along with some as yet unresolved issues and challenges. Early adopters welcome the introduction of such exciting new technologies (figure 1). But from a broad industry standpoint, which mobile phone designs wi... » read more

Blog Review: Nov. 20
By Jesse Allen - 20 Nov, 2019 - Comments: 0

Arm's Ben Fletcher points to research into a new low-cost alternative to through-silicon vias in 3D stacked ICs, particularly cost-sensitive IoT designs, where communication between silicon layers is completely wireless. Cadence's Paul McLellan checks in on the progress of DARPA's OpenROAD project to build a no-human-in-the-loop open source EDA flow for leading-edge nodes. Mentor's Colin ... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 15 Nov, 2019 - Comments: 0

Market research Smartphone shipments in China stood at 98.9 million units in the third quarter of 2019, down 3.6% year-on-year, according to IDC. Of that, 5G phone shipments in China have grown from virtually zero not long ago to 485,000 units in the third quarter of 2019, according to IDC. Vendors shipped devices amid the launch of commercial 5G services in October. The early smartphone le... » read more

Blog Review: Nov. 13
By Jesse Allen - 13 Nov, 2019 - Comments: 0

Applied Materials' Buvna Ayyagari-Sangamalli argues that the siloed structure that produced the computing eras of the past will not be sufficient to fuel the AI era and that a new codesign approach to everything from architecture to materials is needed. Arm's Wendy Elsasser examines emerging non-volatile memories and how they have triggered innovation for new memory protocols and optimized s... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 08 Nov, 2019 - Comments: 0

Chipmakers The IC industry once had several leading-edge vendors that invested and built new fabs. But over time, the field has narrowed due to soaring costs and a dwindling customer base. In 1994, the share of semiconductor industry capital spending held by the top five companies was 25%, according to IC Insights. This meant that a number of companies invested and built new fabs during the... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 01 Nov, 2019 - Comments: 0

Chipmakers China has created a new $29 billion fund to help advance its semiconductor sector, according to reports from Bloomberg and others. Here's another report. The The U.S. and China are in the midst of a trade war. This has prompted China to accelerate its efforts to become more self-sufficient in semiconductor design and production. This includes DRAMs as well as logic/foundry. -----... » read more

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