Technical Paper Round-up: May 31

By Linda Christensen - 31 May, 2022 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=30 /] Semiconductor Engineering is in the process of building this library of research papers. Please send suggestions (via comments section below) for what else you’d like us to incorporate. If you have research papers you are trying to promote, we will review them to see if they are a good fit for... » read more

Using Dynamic Route Map Technique for Insight Into Memristors

By Technical Paper Link - 24 May, 2022 - Comments: 0

New technical paper titled "Empirical Characterization of ReRAM Devices Using Memory Maps and a Dynamic Route Map," from Balearic Islands University, UC Berkeley, Health Institute of the Balearic Islands, International Hellenic University, Technische Universität Dresden, Universidad de Valladolid, and Aristotle University of Thessaloniki. Abstract: "Memristors were proposed in the early 1... » read more

Substitutional synthesis of sub-nanometer InGaN/GaN quantum wells with high indium content

By Technical Paper Link - 03 Nov, 2021 - Comments: 0

Abstract "InGaN/GaN quantum wells (QWs) with sub-nanometer thickness can be employed in short-period superlattices for bandgap engineering of efficient optoelectronic devices, as well as for exploiting topological insulator behavior in III-nitride semiconductors. However, it had been argued that the highest indium content in such ultra-thin QWs is kinetically limited to a maximum of 33%, narro... » read more

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tag: Aristotle University of Thessaloniki

Technical Paper Round-up: May 31

Using Dynamic Route Map Technique for Insight Into Memristors

Substitutional synthesis of sub-nanometer InGaN/GaN quantum wells with high indium content

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tag: Aristotle University of Thessaloniki

Technical Paper Round-up: May 31

Using Dynamic Route Map Technique for Insight Into Memristors

Substitutional synthesis of sub-nanometer InGaN/GaN quantum wells with high indium content

Trending Articles

Shift Left Is The Tip Of The Iceberg

Hybrid Bonding Makes Strides Toward Manufacturability

Americas Chip Funding Energizes Industry

Advanced Packaging Driving New Collaboration Across Supply Chain

Chiplets Make Progress Using Interconnects As Glue

Knowledge Centers Entities, people and technologies explored

Related Articles

Shift Left Is The Tip Of The Iceberg

Partitioning In The Chiplet Era

3.5D: The Great Compromise

AI’s Role In Chip Design Widens, Drawing In New Startups

Key Technologies To Extend EUV To 14 Angstroms

What Comes After HBM For Chiplets

Memory Fundamentals For Engineers

Why Small Fab And Assembly Houses Are Thriving

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