Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 03 Jun, 2022 - Comments: 0

Automotive, mobility Cruise, General Motors’ self-driving car company, obtained a permit to charge for rides in San Francisco, according to a story in Reuters. The California Public Utilities Commission, the regulatory board that can approve permits, voted 4-0 to issue “the first Phase I Driverless Autonomous Vehicle (AV) Passenger Service Deployment permit in California to Cruise LLC to a... » read more

Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 02 Jul, 2020 - Comments: 0

The American Foundries Act, a bipartisan initiative to revive U.S. leadership in the global microelectronics sector, was announced by U.S. Democratic Senator Chuck Schumer from New York. “The economic and national security risks posed by relying too heavily on foreign semiconductor suppliers cannot be ignored, and Upstate New York, which has a robust semiconductor sector, is the perfect place... » read more

Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 07 Feb, 2020 - Comments: 0

Internet of Things SEMI-FlexTech launched six flexible hybrid electronics (FHE) projects, collaborating with U.S. Army Research Laboratory (ARL), to accelerate innovations in sensor and sensor systems. Participating in the projects are American Semiconductor, Inc., University of Texas El Paso, Tekscan, PARC, Alertgy, and Iowa State University, among others. Some of the projects include develop... » read more

The Week In Review: Manufacturing

By Mark LaPedus - 22 Jun, 2018 - Comments: 0

Chipmakers Intel has announced the resignation of Brian Krzanich as chief executive and a member of the board. The board has named Chief Financial Officer Robert Swan as interim chief executive, effective immediately. Intel was recently informed that Krzanich had a “past consensual relationship” with an Intel employee. This is a violation of Intel’s non-fraternization policy, which ap... » read more

Manufacturing Bits: May 1

By Mark LaPedus - 01 May, 2018 - Comments: 0

Adaptive materials The U.S. Army Research Laboratory (ARL) and the University of Maryland have developed a technique to make adaptive materials. Using ultraviolet light, researchers have devised a way that causes a composite material to become stiffer and stronger on-demand. This in turn could enable a variety of new capabilities for the U.S. military, such as rotorcraft design. In this... » read more

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Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

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New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

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by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

New AI Processors Architectures Balance Speed With Efficiency

Hot Chips 24: Large language models ratchet up pressure for sustainable computing and heterogeneous integration; data management becomes key differentiator.

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tag: ARL

Week In Review: Auto, Security, Pervasive Computing

Week In Review: Auto, Security, Pervasive Computing

Week In Review: Auto, Security, Pervasive Computing

The Week In Review: Manufacturing

Manufacturing Bits: May 1

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