tag: ARM

RISC-V’s Software Portability Challenge
By Brian Bailey - 13 Nov, 2024 - Comments: 0

Experts At The Table: RISC-V provides a platform for customization, but verifying those changes remains challenging. Semiconductor Engineering discussed the issue with John Min, vice president of customer service at Arteris; Zdeněk Přikryl, CTO of Codasip; Neil Hand, director of marketing at Siemens EDA (at the time of this discussion); Frank Schirrmeister, executive director for strategi... » read more

Chip Industry Week In Review
By The SE Staff - 08 Nov, 2024 - Comments: 0

Analog Devices acquired Flex Logix's technology assets, along with its technical team. Semiconductor global sales increased 23% in Q3 2024 $166B, up almost 11% versus the same period in 2023, according to SIA. Notable regional year-to-year sales in September: Americas up 46%, China up 23%, Europe down 8%. Fig.1: Worldwide Semiconductor Revenues, year-to-year % change. Source: Semiconduc... » read more

Blog Review: Nov. 6
By Jesse Allen - 06 Nov, 2024 - Comments: 0

Cadence's Satish Kumar C explores how the Deferrable Memory Write transaction type in PCIe and CXL can improve latency, efficiency, and performance by delaying certain memory write operations during system bus congestion or until other priority tasks are complete and highlights implementation and verification challenges. Synopsys' Daryl Seitzer and Rahul Thukral point to magnetoresistive RAM... » read more

EMEA Investments Driving Technology Specialization
By Liz Allan - 04 Nov, 2024 - Comments: 0

Government programs across Europe and the UK are seeing a surge of investments in leading edge technology, materials, and packaging. Industry and academia are coalescing around specialty areas, drawing on established relationships to foster innovation and fill gaps in regional supply chains while also maintaining international bonds. Government initiatives also are picking up in Israel, Saudi A... » read more

Chip Industry Week In Review
By The SE Staff - 01 Nov, 2024 - Comments: 0

Siemens announced plans to acquire Altair Engineering, a provider of industrial simulation and analysis, data science, and high-performance computing (HPC) software, for about $10 billion. Altair's software will become part of Siemens' Xcelerator portfolio and provide a boost to physics-based digital twins. Onto Innovation bought Lumina Instruments, a San Jose, California-based maker of lase... » read more

Chiplets Make Progress Using Interconnects As Glue
By Ann Mutschler - 31 Oct, 2024 - Comments: 0

Breaking up SoCs into their component parts and putting those and other pieces together in some type of heterogeneous assembly is beginning to take shape, fueled by advances in interconnects, complex partitioning, and industry learnings about what works and what doesn't. While the vision of plug-and-play remains intact, getting there is a lot more complicated than initially imagined. It can ... » read more

Revolutionizing High-Performance Silicon With Next-Gen Chiplets
By Shivi Arora - 31 Oct, 2024 - Comments: 0

By Shivi Arora and Sue Hung Fung As 5G wireless communications systems continue to be deployed, enterprises are busy planning for 6G—the next generation of wireless communications set to transform our lives. Poised to merge communication and computing, 6G promises to create a hyperconnected world that blends digital and physical experiences with ultra-fast speeds and low latency as a start... » read more

Blog Review: Oct. 30
By Jesse Allen - 30 Oct, 2024 - Comments: 0

Synopsys' Frank Schirrmeister argues that hardware-assisted verification techniques like emulation and prototyping are essential to help engineers improve design behavior to manage complexity and ensure systems function seamlessly in real-world applications. Siemens’ Stephen V. Chavez finds that ultra high-density interconnect (UHDI) has changed the design and production of PCBs to enable ... » read more

Chip Industry Week In Review
By The SE Staff - 25 Oct, 2024 - Comments: 0

Europe's top court ruled in Intel's favor, voiding a $1.1 billion fine imposed by the European Union and dismissing charges of anti-competitive behavior. IBM released yield benchmarks for high-NA EUV, which serve as proof points that the newest advanced litho equipment will enable scaling beyond the 2nm process node. Also on the lithography front, Nikon is developing a maskless digital litho... » read more

Blog Review: Oct. 23
By Jesse Allen - 23 Oct, 2024 - Comments: 0

Cadence’s Sanjeet Kumar introduces the message bus interface in the PHY Interface for the PCIe, SATA, USB, DisplayPort, and USB4 Architectures (PIPE) specification, which provides a way to initiate and participate in non-latency-sensitive PIPE operations using a small number of wires. Siemens’ Dennis Brophy argues that the recently published Portable Test and Stimulus Standard (PSS) 3.0 ... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2024 SMG   |  Terms of Service  |  Privacy Policy