tag: Arrival

Chip Industry Week In Review

By The SE Staff - 09 Feb, 2024 - Comments: 0

By Jesse Allen, Linda Christensen, and Liz Allan. The Biden administration plans to invest more than $5B for semiconductor R&D and workforce support, including in the National Semiconductor Technology Center (NSTC), as part of the rollout of the CHIPS Act. Today's announcement included at least hundreds of millions for the NSTC workforce efforts, including creating a Workforce Cente... » read more

Startup Funding: October 2020

By Jesse Allen - 02 Nov, 2020 - Comments: 0

October 2020 was a big month for startups across the automotive space, with sizeable funding all around. Three startups based out of China brought in over $100M apiece for ADAS and autonomous driving, and a fourth U.S.-based startup saw $125M investment for simulating and testing autonomous driving systems. Two electric vehicle manufacturers also received $100M+ rounds. Collectively, the auto c... » read more

Startup Funding: January 2020

By Jesse Allen - 05 Feb, 2020 - Comments: 0

A dozen tech startup companies started 2020 with new funding, raising +$500 million between them. Three companies received an impressive amount of investment. Stanford spinout Skylo launched from stealth with $116M in total funding and a bold plan to connect IoT devices, particularly sensors in remote or difficult-to-access environments, with hubs that link them to a network of satellites. ... » read more

Trending Articles

Intel Vs. Samsung Vs. TSMC

Foundry competition heats up in three dimensions and with novel technologies as planar scaling benefits diminish.

Chip Industry Week In Review

Softbank's acquisition; advanced packaging funding; glass substrates; engineered copper wire; semi equipment set new record; HBM4; AI chips rake in funding; X-ray inspection; apprenticeships.

by The SE Staff

Chip Industry Week In Review

DAC; CHIPS funding; CXL standards; Nexperia investment; US curbs tech investments; Accellera's Federated Simulation Group; European sustainability concerns; SIA's tracking tool; Multibeam's multicolumn litho system.

by The SE Staff

Chip Industry Week In Review

Leading-edge foundry plans; DoD IC center; 300mm funding; Intel's apprenticeship program; metrology and test acquisitions; Keysight's chiplet PHY simulation; thermal management in 3D-ICs; foundry growth.

by The SE Staff

Startup Funding: Q2 2024

Big rounds for AI chips; 91 startups raise $2.6 billion.

Knowledge Centers
Entities, people and technologies explored

Related Articles

Intel Vs. Samsung Vs. TSMC

Foundry competition heats up in three dimensions and with novel technologies as planar scaling benefits diminish.

by Ed Sperling

Electromigration Concerns Grow In Advanced Packages

Higher density, heat, and more materials make it harder to ensure reliability.

by Laura Peters

The Race To Glass Substrates

Replacing silicon and organic substrates requires huge shifts in manufacturing, creating challenges that will take years to iron out.

by Gregory Haley

What Works Best For Chiplets

Not all chiplets are interchangeable, and options will be limited.

by Anne Meixner

Controlling Warpage In Advanced Packages

Mechanical stresses increase with larger sizes and heterogeneous materials.

by Laura Peters

Electrically Controlled All-AFM Tunnel Junctions on Silicon with Large Room-Temperature Magnetoresistance (Northwestern)

by Technical Paper Link

Architecting Chips For High-Performance Computing

Data center IC designs are evolving, based on workloads, but making the tradeoffs for those workloads is not always straightforward.

by Ann Mutschler

EDA Looks Beyond Chips

System design, large-scale simulations, and AI/ML could open multi-trillion-dollar markets for tools, methodologies, and services.

by Ed Sperling

About

Navigation

Connect With Us

Facebook
Twitter @semiEngineering
LinkedIn
YouTube

Copyright ©2013-2024 SMG | Terms of Service | Privacy Policy