Chip Industry Week In Review

By The SE Staff - 02 Feb, 2024 - Comments: 0

By Jesse Allen, Gregory Haley, and Liz Allan. Cadence introduced an AI-based thermal stress and analysis platform aimed at 2.5D and 3D-ICs, and cooling for PCBs and electronic assemblies. The company also debuted a HW/SW accelerated digital twin solution for multi-physics system design and analysis, combining GPU-resident computational fluid dynamics (CFD) solvers with dedicated GPU hardwar... » read more

EDA Back On Investors’ Radar

By Brian Bailey - 25 Jan, 2024 - Comments: 0

EDA is transforming from a staid but strategic sector into a hot investment market, fueled by strong earnings and growth, a clamoring for leading-edge and increasingly customized designs across new and existing markets, and the rollout of advanced technologies such as AI for a range of tools that will be needed to develop new architectures with much greater performance per watt. A confluence... » read more

Shifting Left Using Model-Based Engineering

By Karen Heyman - 25 Jan, 2024 - Comments: 0

As heterogenous integration increases design complexity and forces engineers out of long-standing silos, model-based systems engineering (MBSE) is becoming essential for improving quality and reducing failures in the field. While it may seem like a new buzzword, MBSE's principles date back to the 1990s. In essence, it's a process of building models that enable early decisions, which pays off... » read more

Will 2024 Be The Year Of Layered Realities?

By Frank Schirrmeister - 25 Jan, 2024 - Comments: 0

January is always the month of predictions. Our team has already contributed to Semiconductor Engineering's 2023 Look Back and 2024 Outlook. My personal tradition has become to combine the outlook with a look back at what industry experts thought of a decade ago. While this involved a trip to my garage to pick up the respective January IEEE Spectrum issue a decade ago, the new reality is that a... » read more

Rethinking Memory

By Karen Heyman - 22 Jan, 2024 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to talk about the path forward for memory in increasingly heterogeneous systems, with Frank Ferro, group director, product management at Cadence; Steven Woo, fellow and distinguished inventor at Rambus; Jongsin Yun, memory technologist at Siemens EDA; Randy White, memory solutions program manager at Keysight; and Frank Schirrmeister, vice... » read more

Chip Industry Silos Are Crimping Advances

By Brian Bailey - 11 Jan, 2024 - Comments: 0

Change is never easy, but it is more difficult when it involves organizational restructuring. The pace of such restructuring has been increasing over the past decade, and often it is more difficult to incorporate than technological advancements. This is due to the siloed nature of the semiconductor industry, both within the industry itself, and its relationship to surrounding industries. Inc... » read more

The Future Of Memory

By Karen Heyman - 11 Jan, 2024 - Comments: 1

Experts at the Table: Semiconductor Engineering sat down to talk about the impact of off-chip memory on power and heat, and what can be done to optimize performance, with Frank Ferro, group director, product management at Cadence; Steven Woo, fellow and distinguished inventor at Rambus; Jongsin Yun, memory technologist at Siemens EDA; Randy White, memory solutions program manager at Keysight; a... » read more

RISC-V Micro-Architectural Verification

By Brian Bailey - 21 Dec, 2023 - Comments: 3

RISC-V processors are garnering a lot of attention due to their flexibility and extensibility, but without an efficient and effective verification strategy, buggy implementations may lead to industry problems. Prior to RISC-V, processor verification almost became a lost art for most semiconductor companies. Expertise was condensed into the few commercial companies that provided processors or... » read more

Dramatic Changes Ahead For Chips And Systems

By Karen Heyman - 21 Dec, 2023 - Comments: 0

Early this year, most people had never heard of generative AI. Now the entire world is racing to capitalize on it, and that's just the beginning. New markets, such as spatial computing, quantum computing, 6G, smart infrastructure, sustainability, and many more are accelerating the need to process more data faster, more efficiently, and with much more domain specificity. Compared to the days ... » read more

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Chip Industry Week In Review

EDA Back On Investors’ Radar

Shifting Left Using Model-Based Engineering

Will 2024 Be The Year Of Layered Realities?

Rethinking Memory

Chip Industry Silos Are Crimping Advances

The Future Of Memory

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RISC-V Micro-Architectural Verification

Dramatic Changes Ahead For Chips And Systems

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