For Chip Developers, HW/SW Co-Design Key To Data Center Efficiency


Data centers and high-performance computing (HPC) are the primary enablers of today’s power-hungry AI-driven technology, but chip designers, EDA vendors, and the data centers themselves have a long list of options available to them to help curb AI's power consumption. Chip designers play a critical role in ensuring energy efficient processing from the bottom up, whether that is hardware-so... » read more

System Integration With Standards-Based Automation


Today’s semiconductor designs support a broad range of applications, from mobile and edge devices to AI accelerators and data center systems. To keep pace, design teams are shifting from monolithic systems-on-chip (SoCs) to increasingly complex multi-die and chiplet-based architectures. These heterogeneous systems often incorporate IP developed at different times, by different teams, or sourc... » read more

CodaCache Last-Level Cache IP


CodaCache Last-Level Cache (LLC) IP, is a configurable, standalone cache designed to enhance system performance, data locality, scalability, power efficiency, and cost-effectiveness in system-on-chip (SoC) designs. It aims to optimize data sharing among computing engines, accelerators, and data processing blocks by improving prefetching mechanisms to lessen reliance on main memory, thereby enha... » read more

Chip Industry Week in Review


Intel reported flat year-over year revenue for Q2, exceeding Wall Street's pessimistic expectations. In a message to employees, CEO Lip-Bu Tan said the company will: Cut about 15% of its staff, ending the year with about 75,000 employees, down from a high of nearly 132,000 in 2022; Scrap projects in Poland and Germany, consolidate other sites in central America and Southeast Asia, and s... » read more

Accelerating IP Reuse


Semiconductors are no longer monolithic designs developed by a single company. There is more third-party IP from different sources — as many as 1,000 different IPs in a complex SoC — and all of that needs to be integrated and work as one system, something that can require a lot of effort and time. Insaf Meliane, product management and marketing director at Arteris, talks about how the new v... » read more

Crisis Ahead: Power Consumption In AI Data Centers


AI data centers are consuming energy at roughly four times the rate that more electricity is being added to grids, setting the stage for fundamental shifts in where power is generated, where AI data centers are built, and much more efficient system, chip, and software architectures. The numbers are particularly striking for the United States and China, which are in a race to ramp up AI data ... » read more

Chip Industry Week in Review


AI featured big at this week's Design Automation Conference (DAC) in San Francisco. Dozens of companies featured AI-related tools (see product section below), as well as significant improvements to existing tools and some entirely new approaches for designing chips. Among the highlights: Siemens unveiled an AI-enhanced toolset for the EDA design flow that enables customers to integrate the... » read more

Distributing Intelligence Inside Multi-Die Assemblies


The shift from SoCs to multi-die assemblies requires more and smarter controllers to be distributed throughout a package in order to ensure optimal performance, signal integrity, and no downtime. In planar SoCs, many of these kinds of functions are often managed by a single CPU or MCU. But as logic increasingly is decomposed into chiplets, connected to each other and memories by TSVs, hybrid... » read more

Security Vulnerabilities Difficult To Detect In Verification Flow


As designs grow in complexity and size, the landscape for potential hackers to infiltrate a chip at any point in either the design or verification flow increases commensurately. Long considered to be a “safe” aspect of the design process, verification now must be a focus of chip developers from a security perspective. This also means the concept of trust has never been higher, and the tr... » read more

Chip Industry Week in Review


Texas Instruments will invest more than $60 billion to build and expand seven semiconductor fabs in Texas and Utah, supporting more than 60,000 U.S. jobs. Chinese automakers — including SAIC Motor, Changan, Great Wall Motor, BYD, Li Auto and Geely — are aiming to launch new models with 100% homemade chips, some as early as 2026, reports Nikkei Asia. Marvell introduced 2nm custom SRAM ... » read more

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