tag: ASE Group

Assembly Design Rules Slowly Emerge
By Bryon Moyer - 27 Jan, 2025 - Comments: 0

Process design kits (PDKs) play an essential in ensuring that silicon technology can proceed from one generation to the next in a manner that design tools can keep up with. No such infrastructure has been needed for packaging in the past, but that's beginning to change with advanced packages. Heterogeneous assemblies are still ramping up, but their benefits are attracting new designs. “Chi... » read more

Integrated Design Ecosystem For Chiplets And Heterogeneous Integration In Advanced Packaging Technology
By Lihong Cao - 23 Jan, 2025 - Comments: 0

As the demand for high-performance computing (HPC) continues to grow, chiplets and heterogeneous integration have emerged as key solutions due to their significant advantages in improving yield, reusing IP, enhancing performance, and optimizing costs. The integration of chiplets, particularly for AI applications, necessitates a greater number of connections than traditional monolithic system-on... » read more

Electrifying Everything: Power Moves Toward ICs
By Gregory Haley - 23 Jan, 2025 - Comments: 0

As electronic systems grow increasingly complex and energy-intensive, traditional power management methods — centered on centralized systems and external components — are proving inadequate. The next wave of innovation is to bring power control closer to the action — directly on the chip or into a heterogeneous package. This change is driven by a relentless pursuit of efficiency, scala... » read more

Accelerating The AI Economy Through Heterogeneous Integration
By Yin Chang - 17 Dec, 2024 - Comments: 0

The world is rapidly transitioning from an internet economy to an AI economy. In the internet economy, we stayed constantly connected to the internet 24/7 through our smartphones, PCs, and IoT devices. However, in the AI economy, every aspect of our lives is interwoven with artificial intelligence. You may already be familiar with AI tools such as ChatGPT or Google Gemini, which answer question... » read more

FOPLP Gains Traction in Advanced Semiconductor Packaging
By Gregory Haley - 21 Nov, 2024 - Comments: 1

Fan-Out Panel-Level Packaging (FOPLP) for advanced nodes, once hindered by manufacturability and yield challenges, is emerging as a promising solution to meet the industry’s demands for higher integration densities and cost efficiency. Traditionally, FOPLP has been a go-to solution for cost-sensitive applications in consumer electronics, IoT devices, and mid-tier automotive systems. Its ab... » read more

ECTC 2024 Session Readout: Advancement of Metrology
By Technical Paper Link - 04 Sep, 2024 - Comments: 0

A Electronic Components and Technology Conference (ECTC) session report titled "2024 ECTC Special Session Report: Advancing Metrology for Next-Generation Microelectronics" was published by NIST, Binghamton University, and TechSearch International. Abstract: "Metrology plays a pivotal role in semiconductor research, manufacturing, packaging and assembly. It is critical to the success of this... » read more

The Race To Glass Substrates
By Gregory Haley - 29 May, 2024 - Comments: 4

The chip industry is racing to develop glass for advanced packaging, setting the stage for one of the biggest shifts in chip materials in decades — and one that will introduce a broad new set of challenges that will take years to fully resolve. Glass has been discussed as a replacement material for silicon and organic substrates for more than a decade, primarily in multi-die packages. But ... » read more

AI-Driven Innovation For Manufacturing Automation
By Calvin Shiao - 18 Jan, 2024 - Comments: 0

By Calvin Shiao, AshtonWS Huang, and Alfos Hsu Artificial intelligence (AI) is changing the world and improving our lives in many ways. The semiconductor industry is a key part of the AI revolution, as it provides powerful computing chips for AI applications and leverages AI to optimize business operations and management, customer service, office workflows, as well as the intricate realms of... » read more

Goals of Going Green
By Anne Meixner - 25 Jul, 2023 - Comments: 0

The chip industry is stepping up efforts to be seen as environmentally friendly, driven by growing pressure from customers and government regulations. Some manufacturers have been addressing sustainability challenges for more than a decade, but they are becoming more aggressive in their efforts, while others are joining them. A review of sustainability reports across the semiconductor indust... » read more

Week In Review: Semiconductor Manufacturing, Test
By Gregory Haley - 21 Apr, 2023 - Comments: 0

GlobalFoundries filed suit in U.S. District Court in New York against IBM, accusing it of unlawfully disclosing IP and trade secrets to IBM partners, including Intel and Rapidus, potentially receiving hundreds of millions of dollars in licensing income and other benefits. The European Union released a €43 billion ($47 billion) plan for jumpstarting its semiconductor manufacturing industry,... » read more

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