tag: ASE

The Week In Review: Manufacturing
By Mark LaPedus - 08 Jan, 2016 - Comments: 0

2016 is starting off on the wrong foot. Samsung disclosed its preliminary results for the forth quarter. Samsung expects a difficult business environment in 2016, according to reports. Plus, Apple is seeing lower than expected demand. “We are lowering our March quarter iPhone units to 45M units (prior 54M) to reflect incremental softness and recent production cuts. Our sense is that iPhones a... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 24 Dec, 2015 - Comments: 0

South Korea’s SK Hynix led the initial charge in the development of High Bandwidth Memory (HBM), a 3D DRAM technology based on a memory stack and through-silicon vias (TSVs). SK Hynix has been shipping HBM parts in the market. Now, SK Hynix and Samsung are readying the next version of the technology, dubbed High Bandwidth Memory 2 or HMB2, according to a report from The Electronic Times of So... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 18 Dec, 2015 - Comments: 1

Samsung plans to make a major entry into the drone market, according to reports. “Samsung is not alone in focusing on the drone market,” said Will Strauss, president of Forward Concepts, in a research note. “At CES next month in Las Vegas, one can expect new products from drone market leader DJI, but dozens of new drone models from Parrot and many other companies. Even GoPro chip maker A... » read more

Fan-Out Packaging Gains Steam
By Mark LaPedus - 23 Nov, 2015 - Comments: 1

Fan-outs are creating a buzz and gaining steam in the market at a pace far beyond what anyone would have expected even at the start of the year. The approach, which has been around for several years, is a wafer-level packaging process that enables ultra-thin, high-density packages. So why the buzz? Apple is apparently moving to [getkc id="202" kc_name="fan-out"] packaging, according to an... » read more

Why Packaging Matters
By Ed Sperling - 19 Nov, 2015 - Comments: 1

The semiconductor package is changing. What was until very recently considered an afterthought is now becoming a key part of the design process at all major chipmakers, and a critical factor in the extension of Moore's Law. This is a sharp reversal of what was almost universally an afterthought in planar silicon design and manufacturing. Rarely was the package an integral part of the archite... » read more

Packaging Wars Ahead
By Ed Sperling - 19 Nov, 2015 - Comments: 0

There has been much talk about semiconductor industry consolidation, but the shift into advanced packaging could have more far-reaching effects than all the mega-deals so far. Packaging is big business. Yole Développement has pinned the market at $30 billion, but that's only a thin slice of the pie that's in play. Companies that win the packaging deals also have a good shot of winning the m... » read more

More Choices, Less Certainty
By Ed Sperling - 04 Nov, 2015 - Comments: 3

The increasing cost of feature scaling is splintering the chip market, injecting uncertainty into a global supply chain that has been continually fine-tuned for decades. Those with deep enough resources and a clear need for density will likely follow Moore's Law, at least until 7nm. What comes after that will depend on a variety of factors ranging from available lithography—EUV, multi-bea... » read more

What China Is Planning
By Mark LaPedus - 21 Oct, 2015 - Comments: 1

Over the years, China has unveiled several initiatives to advance its domestic semiconductor industry. China has made some progress at each turn, although every plan has fallen short of expectations. But now, the nation is embarking on several new and bold initiatives that could alter the IC landscape. China’s new initiatives address at least three key challenges for its IC industry: 1. C... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 16 Oct, 2015 - Comments: 0

Looking to propel the next wave of OLED displays, Applied Materials has rolled out two new systems. The tools enable the volume production of OLED displays for both mobile products and TVs. In addition, Applied Materials has shipped an Applied TopMet roll-to-roll metal deposition system to Jindal Poly Films, a leader in PET and BOPP films for flexible packaging and labeling applications. In... » read more

Security In 2.5D
By Ed Sperling - 12 Oct, 2015 - Comments: 2

The long-anticipated move to 2.5D and fan-outs is raising some familiar questions about security. Will multiple chips combined in an advanced package be as secure as SoCs where everything is integrated on the same die? The answer isn't a simple yes or no. Put in perspective, all chips are vulnerable to [getkc id="253" kc_name="side channel attacks"], hacking of memory—a risk that increases... » read more

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