tag: Astronics

The Week In Review: Manufacturing
By Mark LaPedus - 06 Oct, 2017 - Comments: 0

Test, measurement and fab tools National Instruments (NI) has released a report that explores the future trends in the electronics industry. The report, called the NI Trend Watch 2018, looks at the technological advances and some of the biggest challenges engineers face in 2018. The report from NI looks at the following topics—machine learning; test challenges for 5G; IIoT; and effects of... » read more

How To Make Autonomous Vehicles Reliable
By Ann Mutschler - 11 Sep, 2017 - Comments: 1

The number of unknowns in automotive chips, subsystems and entire vehicles is growing as higher levels of driver assistance are deployed, sparking new concerns and approaches about how to improve reliability of these systems. Advanced Driver Assistance Systems (ADAS) will need to detect objects, animals and people, and they will be used for parking assistance, night vision and collision avoi... » read more

Astronics Ballard Technology OmniBus II PXI Express Product for Avionics Test
By NI - 11 Sep, 2017 - Comments: 0

The OmniBus II PXIe databus interface products combine the standard PXIe interface with MIL-STD-1553 and ARINC 429 Avionics Data Bus interfaces. Interface cards can be ordered with either MIL-STD-1553 only, ARINC 429 only, or both interfaces on the same card. The PXIe interface includes a PCIe x1 interface to the controller as well as support for PXI clock, timing and trigger signals. The inclu... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 08 Sep, 2017 - Comments: 1

Chipmakers Toshiba is still looking for a buyer for its prized NAND flash memory business. The leading contenders for the business are a consortium with Western Digital. Meanwhile, Toshiba’s memory unit is expanding its Fab 6 facility at its Yokkaichi Operations, based in Japan. And now, it has selected a site for its next fab in Japan, this time in Kitakami City, Iwate. Construction is expe... » read more

Advanced Packaging Moves To Cars
By Ann Mutschler - 07 Aug, 2017 - Comments: 0

By Ann Steffora Mutschler and Ed Sperling As automotive OEMs come up to speed on electrification of vehicles, each at their own pace, they are starting to embrace novel packaging approaches as a way to differentiate themselves in an increasingly competitive market. Wirebond used to dominate this market, where most of the chips were relatively unsophisticated and product cycles were slow�... » read more

Astronics Test Systems And Tabor Electronics End Obsolescence For NAVAIR
By Astronics - 07 Aug, 2017 - Comments: 0

Obsolescence. This is not a favorite word for most end users. Flexibility, options, extended product life – those words bring relief to the testing environments of end users. Yet, nonetheless, obsolescence is a factor that must be faced within the testing industry. When the US Naval Air Systems Command (NAVAIR) faced obsolescence with a major Test & Measurement OEM, they turned to Astr... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 04 Aug, 2017 - Comments: 0

Chipmakers The situation between Toshiba and its fab partner, Western Digital (WD), has gone from bad to worse. As reported, troubled Toshiba recently selected a group to buy its memory business. The consortium includes the Innovation Network Corp. of Japan, the Development Bank of Japan and Bain Capital. Rival SK Hynix is also part of the group. WD attempted but failed to buy the unit, an... » read more

5G Test Equipment Race Begins
By Jeff Dorsch - 12 Jul, 2017 - Comments: 0

Test and measurement vendors stand ready to help with the development and deployment of 5G wireless communications, as the technology is fine-tuned and tested in trials around the world. Juniper Research forecasts 5G operator-billed service revenues will rise to $269 billion by 2025, compared with $851 million in 2019, for a compound annual growth rate of 161% during the first seven years of... » read more

Test at “West”
By Jeff Dorsch - 10 Jul, 2017 - Comments: 0

As you wander through the North Hall of Moscone Center this week, you may notice that some of the big names in automated test equipment are not on the SEMICON West show floor this year. Advantest America has a booth, but the same cannot be said of Teradyne or Xcerra. Some of the bigger names in test and measurement instruments won’t be found exhibiting at SEMICON West, either – such as Keys... » read more

Chip Test Shifts Left
By Jeff Dorsch - 07 Jun, 2017 - Comments: 0

“Shift left” is a term traditionally applied to software testing, meaning to take action earlier in the V-shaped time line of a project. It has recently been touted in electronic design automation and IC design, verification, and test. “Test early and test often” is the classic maxim of software testing. What if that concept could also be implemented in semiconductor testing, to redu... » read more

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