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Speeding-Up Thermal Simulations Of Chips With ML


A new technical paper titled "A Thermal Machine Learning Solver For Chip Simulation" was published by researchers at Ansys. Abstract "Thermal analysis provides deeper insights into electronic chips' behavior under different temperature scenarios and enables faster design exploration. However, obtaining detailed and accurate thermal profile on chip is very time-consuming using FEM or CFD. Th... » read more

Autoencoder-Based Characterisation Of Passive IEEE 802.11 Link Level Measurements


Wireless networks are indispensable in today’s industrial manufacturing and automation. Due to harsh signal propagation conditions as well as co-existing wireless networks, transmission failures resulting in severe application malfunctions are often difficult to diagnose. Remote wireless monitoring systems are extremely useful tools for troubleshooting such failures.However, the completeness ... » read more