tag: automotive

Chiplets for Future Automotive Application
By Fraunhofer IIS/EAS - 13 Nov, 2024 - Comments: 0

Abstract Autonomous vehicles and associated ADAS systems are driving vehicle electronics content to unprecedented levels. These systems require significant processing power via a centralized system. Chiplets are one solution to distribute functionality on different technologies and can help to secure the supply chain and reduce rising development costs in advanced IC nodes. This traditionally ... » read more

Extending Chip Lifetime With Safer Voltage Scaling
By Eyal Fayneh - 12 Nov, 2024 - Comments: 0

What if your chips lived 20% longer without compromising performance, and even while reducing power consumption? How would it affect your product’s reliability and cost? What would be the effect on your profitability? With the demand for longer-lasting chips growing across industries, designers and reliability engineers face increasing pressure to ensure their products perform correctly fo... » read more

Reliability On The Road: Multiphysics Design For Automotive 3D-ICs
By John Ferguson - 07 Nov, 2024 - Comments: 0

Anyone who has purchased a car over the past decade knows that there has been a huge increase in the amount of compute processing involved in today’s modern automotive industry. Advanced chips for diagnostics and entertainment as well as logic associated with advanced sensor technology and automated assist features have quickly become key requirements that drivers rely on every day to ensure ... » read more

Automotive OEMs Focus On SDVs, Zonal Architectures
By Ann Mutschler - 07 Nov, 2024 - Comments: 0

Giant automotive OEMs are re-evaluating how quickly to move to advanced technologies and software-driven designs amid crushing financial pressure from low-cost EVs developed in other markets such as China. U.S., European, and Japanese OEMs have been struggling for the past half-decade or so to figure out which is the best approach to developing EVs, undergoing multiple shifts in both hardwar... » read more

PCIe IP With Enhanced Security For The Automotive Market
By Dana Neustadter - 07 Nov, 2024 - Comments: 0

The automotive industry is undergoing a rapid transformation, with connectivity and automation becoming integral components of modern vehicles. However, this increased connectivity also brings heightened risks. The automotive industry takes many measures to ensure safety for vehicles, but it is crucial to understand that these safety measures are ineffective if the vehicle's security is comprom... » read more

New Challenges In IC Reliability
By Ed Sperling - 15 Oct, 2024 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss reliability of chips, how it is changing, and where the new challenges are, with Steve Pateras, vice president of marketing and business development at Synopsys; Noam Brousard, vice president of solutions engineering at proteanTecs; Harry Foster, chief verification scientist at Siemens EDA; and Jerome Toublanc, high-tech soluti... » read more

Radar-Based Vital Signs Detection For In-Cabin Applications
By Cadence - 10 Oct, 2024 - Comments: 0

Radars have been at the forefront of the automotive industry for some time now. They play an integral part in advanced driver assistance systems (ADAS) and aid in applications such as adaptive cruise control, collision mitigation, blind spot detection, lane change assist, and many other applications. In-cabin sensing is an emerging area in the automotive industry, and radars play an integral... » read more

Lightweight, High-Performance CPU Extension for Protected Key Handles with CPU-Enforced Usage (CISPA, Ruhr Univ. Bochum)
By Technical Paper Link - 09 Oct, 2024 - Comments: 0

A new technical paper titled "KeyVisor -- A Lightweight ISA Extension for Protected Key Handles with CPU-enforced Usage Policies" was published by researchers at CISPA Helmholtz Center for Information Security and Ruhr University Bochum. Abstract "The confidentiality of cryptographic keys is essential for the security of protection schemes used for communication, file encryption, and outsou... » read more

Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications
By InRak Kim - 19 Sep, 2024 - Comments: 0

The conventional flip chip ball grid array (FCBGA) package platform has wide industry usage and provides high electrical performance. However, as high performance requirements increased, it encounters significant challenges. FCBGA packages frequently encounter underfill cracks after long term reliability or harsh reliability test conditions for automotive devices. Figure 1 shows the typical und... » read more

Legacy Process Nodes Are Critical To Many Industries
By David Park - 19 Sep, 2024 - Comments: 0

As the semiconductor industry continues to push the boundaries of innovation with advanced nodes, it is easy to overlook the critical role that ICs manufactured at legacy process nodes play in our everyday lives. While the spotlight often shines on the leading-edge advancements of 5nm technology and below, it’s the mature nodes, those above 28nm and even above 130nm, that are the unsung ch... » read more

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