tag: automotive

A Survey Of Digital Twins and Other Prototyping Technologies for Vehicles
By Technical Paper Link - 26 Apr, 2025 - Comments: 0

A new technical paper titled "Digital Twin Technologies for Vehicular Prototyping: A Survey" was published by researchers at Central Michigan University and University of Florida. Abstract "Digital Twin (DT) technology is widely regarded as one of the most promising tools for industry development, demonstrating substantial application across numerous cyber-physical systems. Gradually, this ... » read more

Can Chiplets Serve Cost-Conscious Apps?
By Bryon Moyer - 17 Apr, 2025 - Comments: 0

Chiplets are emerging as a significant new phase in the evolution of the semiconductor market, providing a way to continue scaling performance well beyond the size limitations of a reticle. But that improvement comes with a high price tag and a lot more complexity, which so far has limited adoption. One of the main reasons for the cost increase is the need for advanced packaging when employi... » read more

Lego-Style Software For Automotive And Industrial Chiplet Systems?
By Andy Heinig - 10 Apr, 2025 - Comments: 0

Chiplets are a key topic in the semiconductor industry today, as they offer the potential to greatly increase the performance and flexibility of chips. The current focus is primarily on implementation, in particular on the architecture and the development of die-to-die interfaces that enable efficient communication between the individual chips. These technologies hold out the promise of meeting... » read more

Emerging Cybersecurity Risks in Connected Vehicles, With Focus On In-Vehicle and Vehicle-Edge Platforms
By Technical Paper Link - 04 Apr, 2025 - Comments: 0

A new technical paper titled "Security Risks and Designs in the Connected Vehicle Ecosystem: In-Vehicle and Edge Platforms" was published by researchers at Università di Pisa, Ford Motor Company, MIT, and the Institute of Informatics and Telematics (Pisa). Abstract "The evolution of Connected Vehicles (CVs) has introduced significant advancements in both in-vehicle and vehicle-edge platfor... » read more

Accelerating The Shift To Software-Defined Vehicles
By Marion Heiss - 03 Apr, 2025 - Comments: 0

The automotive E/E architecture is undergoing a significant transformation, driven by the vision of a software-defined vehicle (SDV). This shift is leading to a change from traditional distributed and domain-based architectures to more centralized and mixed domain-zone architectures. Central Electronic Control Units (ECUs) are now powered by sophisticated system-on-chips (SoCs) that combine com... » read more

How Physical AI Is Redefining The Automotive Industry
By Reela Samuel - 03 Apr, 2025 - Comments: 0

The automotive world is experiencing a groundbreaking transformation, with technology and AI-driven innovation at its core. Among the most significant advancements is the rise of physical AI, a concept that is redefining the industry from the ground up. Physical AI goes beyond traditional artificial intelligence by enabling autonomous systems to seamlessly perceive, understand, and interact wit... » read more

Redefining The Role Of The GPU In Next-Generation Vehicles
By Eleanor Brash - 03 Apr, 2025 - Comments: 0

Automotive architectures are experiencing a seismic shift, with the traditional distributed architecture being steadily replaced with a more cost-effective centralized model. Even taken in isolation, this would be a significant driver on the computing needs of next-generation automotive SoCs, but the complexity of the problem is compounded when considered alongside the simultaneous rise of adva... » read more

Benefits And Challenges In Multi-Die Assemblies
By Ed Sperling And Laura Peters - 02 Apr, 2025 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss chiplets, hybrid bonding, and new materials with Michael Kelly, vice president of Chiplets and FCBGA Integration at Amkor; William Chen, fellow at ASE; Dick Otte, CEO of Promex Industries; and Sander Roosendaal, R&D director at Synopsys Photonics Solutions. What follows are excerpts of that discussion. To view part one of t... » read more

First-Time Silicon Success Plummets
By Ed Sperling - 27 Mar, 2025 - Comments: 0

First-time silicon success is falling sharply due to rising complexity, the need for more iterations as chipmakers shift from monolithic chips to multi-die assemblies, and an increasing amount of customization that makes design and verification more time-consuming. Details from a new functional verification survey[1] highlight the growing difficulty of developing advanced chips that are both... » read more

Eliminating Interfacial Delamination in High-Power Automotive Devices
By Chin Joo Tan - 20 Mar, 2025 - Comments: 0

Highly reliable power devices are always demanded by the automotive industry, especially with the surge in electric vehicle (EV) sales. These devices are expected to withstand harsh conditions and, at the same time, deliver consistent performances. Interfacial delamination is a significant factor that can impact the reliability performance of power devices. It refers to the separation of lay... » read more

← Older posts

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2025 SMG   |  Terms of Service  |  Privacy Policy