Smarter Cars, But How Smart?

By Ernest Worthman - 09 Dec, 2014 - Comments: 0

With the emergence of the Internet of Things, smart cars are beginning to garner more attention — the kind that comes with real R&D dollars, market development plans and cost analyses for future commercialization. Smart cars are different than connected cars, which are simply smartphones on wheels. Until now, the focus on intelligence in automobiles has largely been on driver assist and in... » read more

IoT Growing Pains

By Ed Sperling - 04 Sep, 2014 - Comments: 0

The Internet of Things is having one of those defining moments — and not in a good way. Only a limited number of things will work together at first. Only in rare case will they actually cross boundaries between vertical markets such as consumer or home, automotive and medical. And in no cases will there be any guarantees, at least in the short term, that communications will be reliable, secur... » read more

Blog Review: July 2

By Ed Sperling - 02 Jul, 2014 - Comments: 0

Mentor’s Nazita Saye has reservations about driverless cars. Sometimes it’s actually fun to drive—and sometimes it isn’t. Cadence’s Brian Fuller is a bit more optimistic about driverless cars. He says that from the standpoint of safety, efficiency and environment, autonomous vehicles will be a big step forward—if and when some critical problems are solved. And along the same... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: autonomous vehicles

Smarter Cars, But How Smart?

IoT Growing Pains

Blog Review: July 2