Week In Review: Design, Low Power

By Jesse Allen - 17 Jul, 2020 - Comments: 0

Siemens will acquire Avatar Integrated Systems. The company's place-and-route tools, which will become part of Mentor's Xcelerator portfolio, include a netlist-to-GDS full-function block-level physical implementation tool and a complete top-level prototyping, floor-planning and chip assembly tool. Based in Santa Clara, CA, Avatar was formed in 2017 from the acquired assets of ATopTech. ATopTech... » read more

EDA Grabs Bigger Slice Of Chip Market

By Brian Bailey - 31 Jan, 2019 - Comments: 0

EDA revenues have been a fairly constant percentage of semiconductor revenues, but that may change in 2019. With new customers creating demand, and some traditional customers shifting focus from advanced nodes, the various branches of the EDA tool industry may be where sticky technical problems are solved. IC manufacturing, packaging and development tools all are finding new ways to handle t... » read more

The Impact of Moore’s Law Ending

By Brian Bailey - 29 Oct, 2018 - Comments: 2

Over the past couple of process nodes the chip industry has come to grips with the fact that Moore's Law is slowing down or ending for many market segments. What isn't clear is what comes next, because even if chipmakers stay at older nodes they will face a series of new challenges that will drive up costs and increase design complexity. Chip design has faced a number of hurdles just to get ... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Avatar Integrated Systems

Week In Review: Design, Low Power

EDA Grabs Bigger Slice Of Chip Market

The Impact of Moore’s Law Ending