Test Challenges Rising For Mobile Devices

By Mark LaPedus - 20 Mar, 2014 - Comments: 0

Smartphone and tablets continue to advance at a dizzying pace. On the component side alone, the latest mobile devices are moving towards 64-bit application processors, multi-mode RF front-ends, higher-end cameras and flashy LCD screens. Some systems even boast fingerprint scanners and heart rate sensors. But an obvious part of the system continues to lag behind the curve—battery life. In r... » read more

The Power Treadmill

By Frank Ferro - 25 Apr, 2013 - Comments: 0

By Frank Ferro The recent purchase of an LTE smart phone has me back on my power management soapbox. I upgraded my phone about a month ago to the newest version (staying with the same manufacturer as my previous device) and to my dismay, although it wasn’t completely unexpected, the battery life was actually shorter. I did not do a ‘scientific’ comparison, but following the same daily us... » read more

Silence Is Golden

By Ann Mutschler - 01 Dec, 2010 - Comments: 0

As the industry continues to march along building devices with ever-increasing battery life, it is necessary to migrate to the latest and greatest process nodes, which as we all know are smaller and use lower voltages. However, any noise in the system—whether it was there before or you start to use something like USB 3.0 or SATA or something else—is actually going to increase the number of ... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

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3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

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Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

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The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

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Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

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tag: battery life

Test Challenges Rising For Mobile Devices

The Power Treadmill

Silence Is Golden