Achieving Fast And Accurate Extraction Of 3D-IC Layout Structures

The electronics industry is devoting a lot of energy to exploring “More than Moore’s Law” approaches that drive continued value scaling through system integration, rather than (or in addition to) shrinking transistors. One of the most promising techniques is the creation of 3D-ICs using TSV structures. However, accurately modeling a 3D multi-die system requires tools that extract precise ... » read more