Preparing For Ferroelectric Devices

By Katherine Derbyshire - 02 Oct, 2024 - Comments: 0

The discovery of ferroelectricity in materials that are compatible with integrated circuit manufacturing has sparked a wave of interest in ferroelectric devices. Ferroelectrics are materials with a permanent polarization, the direction of which can be switched by an applied field. This polarization can be used to raise or lower the threshold voltage of a transistor, as in FeFETs, or it can c... » read more

Power/Performance Bits: Jan. 5

By Jesse Allen - 05 Jan, 2021 - Comments: 0

Quiet qubits Researchers at the University of New South Wales Sydney recorded the lowest noise levels yet for a semiconductor qubit. Charge noise caused by material imperfections interferes with the information encoded on qubits, reducing accuracy. "The level of charge noise in semiconductor qubits has been a critical obstacle to achieving the accuracy levels we need for large-scale error-c... » read more

System Bits: July 26

By Ann Mutschler - 26 Jul, 2016 - Comments: 0

Mixing topology, spin MIT researchers are studying new compounds, such as topological insulators (TIs), which support protected electron states on the surfaces of crystals that silicon-based technologies cannot as part of the pursuit of material platforms for the next generation of electronics. They report new physical phenomena being realized by combining this field of TIs with the subfiel... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Beijing Institute of Technology

Preparing For Ferroelectric Devices

Power/Performance Bits: Jan. 5

System Bits: July 26